Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF2119DU/2/2Z by NXP Semiconductors is a versatile interface IC designed for segment displays, featuring 80 segments and 18 backplanes. It operates within a wide voltage range of 1.5-6.5V and withstands temperatures from -40 °C to 85 °C, making it ideal for industrial applications. This CMOS technology ensures reliable performance in demanding environments.
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The SEGMENT display mode allows for clear and efficient representation of numerical and alphanumeric information, making it suitable for various applications requiring readability.
The flexible power supply options enable compatibility with a wide range of devices, enhancing versatility in different applications.
With 18 backplanes, this IC supports complex display configurations, allowing for intricate designs that can accommodate more information on the screen.
The high maximum operating temperature makes this product ideal for use in environments with elevated temperatures, ensuring reliable performance in demanding conditions.
The low minimum operating temperature ensures functionality in cold environments, making this IC suitable for industrial applications where temperature fluctuations are common.
Designed for industrial-grade applications, this product meets stringent requirements for reliability and durability, making it suitable for harsh operational settings.
CMOS technology provides low power consumption and high speed, making this IC energy-efficient while maintaining rapid performance.
With 80 segments available, this IC offers a high level of detail and versatility, allowing for complex representations in products ranging from simple indicators to advanced displays.
Other Function Interface ICs PCF2119DU/2/2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
Display Mode:
No. of Backplanes:
No. of Segments:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Power Supplies (V):
Qualification:
Sub-Category:
Technology:
Temperature Grade:
PCF2119DU/2/2Z Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 29/Nov/2021
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Sensitron Semiconductor
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
Bytesonic Electronics
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
Fairchild Semiconductor
PCA9512ADP,118
PCA9512ADP,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 2.7V to 5.5V and max current of 3.6mA. It operates in industrial temperatures (-40°C to 85°C) and is suitable for bus buffer applications due to its small outline package style and dual terminal position.
ISOW7841FAQDWEQ1
Texas Instruments
ISOW7841FAQDWEQ1 by Texas Instruments is a CMOS interface IC with 4 functions, suitable for automotive applications. It operates b/w -40 to 125 °C and has a supply voltage range of 3-5.5 V. This small outline IC with dual terminals is AEC-Q100 compliant and ideal for various other function interface requirements.
ISO7841DWR
ISO7841DWR by Texas Instruments is a digital isolator with 4 channels, operating at -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The IC features CMOS technology, Gull Wing terminals, and is surface mountable with moisture sensitivity level of 2.
ADUM1401BRWZ
Analog Devices
ADUM1401BRWZ by Analog Devices is a 16-terminal IC with 4 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at supply voltages ranging from 2.7V to 5.5V, making it ideal for industrial applications requiring reliable signal transmission.
ZIOL2401BI1W
Integrated Device Technology
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
253
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; No. of Terminals: 22; Nominal Supply Voltage: 5 V; Nominal Negative Supply Voltage: -5 V; Package Equivalence Code: FL22,.4;
SI8422AB-D-ISR
Skyworks Solutions
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TUSB321AIRWBR
TUSB321AIRWBR by Texas Instruments is an interface IC with 12 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.5-5.5 V and peak reflow temperature of 260C. Ideal for industrial applications requiring very thin profile chip carriers in surface mount packages.
ADUM5401WCRWZ-1RL
ADUM5401WCRWZ-1RL by Analog Devices is a 16-terminal IC with supply voltage range of 3V to 5.5V, operating from -40°C to 105°C. It's a small outline package suitable for industrial applications requiring interface circuitry in compact spaces.
ADUM4160BRWZ
ADUM4160BRWZ by Analog Devices is a small outline interface IC with 16 terminals and a max seated height of 2.65 mm. It has a temperature grade of industrial and uses CMOS technology. This IC is commonly used in various applications requiring an interface circuit for other functions.
TXB0108RGYRG4
TXB0108RGYRG4 by Texas Instruments is an interface IC with 20 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.2-5.5 V and terminal finish of NiPdAu. Widely used in industrial applications requiring reliable signal conversion and processing capabilities.
XSN6505BQDBVTQ1
XSN6505BQDBVTQ1 by Texas Instruments is a small outline interface IC with 6 terminals, operating at -40 to 125°C. It has a supply voltage range of 2.25-5.5V and AEC-Q100 screening for automotive applications. The package is rectangular, low profile, with gull wing terminals suitable for surface mount assembly.
SI8662BB-B-IU
Silicon Labs
SI8662BB-B-IU by Silicon Labs is a digital isolator with 1 function, operating voltage range of 2.375-5.5V, and AEC-Q100 screening for automotive applications. It features a small outline package style, CMOS technology, and dual terminal position suitable for various interface designs in harsh environments.
XISO6741DWR
XISO6741DWR by Texas Instruments is a digital isolator with 4 channels, operating at -40 to 125°C. It has a supply voltage range of 1.71V to 5.5V and comes in a small outline package suitable for automotive applications. The IC uses CMOS technology and features gull wing terminals with a pitch of 1.27mm, making it ideal for various interface functions.
TXS0104ED
TXS0104ED by Texas Instruments is a 4-bit interface IC with 3-STATE output. It operates b/w -40 to 85°C, with supply voltage ranging from 1.65V to 5.5V. Ideal for industrial applications requiring small outline package and surface mount compatibility.
ISO7741DWR
ISO7741DWR by Texas Instruments is a 4-channel interface IC with CMOS technology. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V and small outline package style, it's ideal for various function interface designs.
MAX4896ATP+T
MAX4896ATP+T by Analog Devices is a BICMOS technology interface IC with 8-bit driver. It operates b/w -40 to 85°C, with supply voltage range of 2.7-5.5V. Suitable for industrial applications requiring very thin profile and low output current (0.0001A).
ISO6742FDWR
The Texas Instruments ISO6742FDWR is a CMOS interface IC with 4 functions, suitable for automotive applications. It operates b/w -40 to 125°C, with supply voltage ranging from 1.71V to 5.5V. This small outline package has 16 terminals and is surface mountable, making it ideal for various electronic systems.
SI8641BD-B-IS2R
SI8641BD-B-IS2R by Silicon Labs is a digital isolator with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 2.375V to 5.5V and comes in a small outline package for various interface applications.
ISOUSB211DPR
ISOUSB211DPR by Texas Instruments is a small outline interface IC with 28 terminals. It operates b/w -40 to 125°C and has a supply voltage range of 1.71-1.94V. Ideal for applications requiring dual terminal positions and surface mount compatibility.
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PCF2112CT
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCF2112TD
PCF2113DH/4
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
PCF2119AU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119FU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5; Maximum Operating Temperature: 85 Cel;
PCF2119IU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; No. of Backplanes: 18-BP; Qualification: Not Qualified; Technology: CMOS;
PCF2119RU/2DB/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 80; No. of Backplanes: 18-BP; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119RU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Technology: CMOS; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119SU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
PCF2111CP
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
PCF2112P
PCF2114CU
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 3/5; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2114GU
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; No. of Backplanes: 32-BP; No. of Segments: 60; Qualification: Not Qualified;
PCF2116CHZ
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR;
PCF2119RU/2
Other Interface ICs; Temperature Grade: OTHER; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2119SU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Segments: 80; Maximum Operating Temperature: 85 Cel;
PCF2119VU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119AU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; No. of Segments: 80; Power Supplies (V): 1.5/5.5,2.2/6.5; Package Equivalence Code: DIE OR CHIP;
PCF2119DU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5;
PCF2119FU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Backplanes: 18-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel;
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