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PCF2119DU/2/2Z

NXP Semiconductors

PCF2119DU/2/2Z by NXP Semiconductors

PCF2119DU/2/2Z by NXP Semiconductors is a versatile interface IC designed for segment displays, featuring 80 segments and 18 backplanes. It operates within a wide voltage range of 1.5-6.5V and withstands temperatures from -40 °C to 85 °C, making it ideal for industrial applications. This CMOS technology ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,865 parts In-Stock

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Digiode

USA . 4,932 parts In-Stock

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Anansix

USA . 1,052 parts In-Stock

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1,052

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Vigor

Singapore . 475 parts In-Stock

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$2.330

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One Stop Electronics

USA . 936 parts In-Stock

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$13.500

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936

$13.500

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AZTECH Wire

Italy . 561 parts In-Stock

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$18.520

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561

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QUARKTWIN TECHNOLOGY LTD

USA . 15,279 parts In-Stock

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UNI Independent Distributors

Spain . 6,129 parts In-Stock

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Corphita

USA . 3,868 parts In-Stock

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Microchip USA

USA . 3,009 parts In-Stock

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Overview

Unlock the potential of your projects with the PCF2119DU/2/2Z from NXP Semiconductors. Renowned for their commitment to innovation and quality, NXP delivers a robust interface IC that excels in industrial applications. With its versatile segment display capabilities and wide operating temperature range, this product ensures reliability in demanding environments, providing you with unmatched performance and peace of mind. Elevate your designs today!

Feature Benefit Bullets

Display Mode: SEGMENT

The SEGMENT display mode allows for clear and efficient representation of numerical and alphanumeric information, making it suitable for various applications requiring readability.

Power Supplies (V): 1.5/5.5, 2.2/6.5

The flexible power supply options enable compatibility with a wide range of devices, enhancing versatility in different applications.

No. of Backplanes: 18-BP

With 18 backplanes, this IC supports complex display configurations, allowing for intricate designs that can accommodate more information on the screen.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product ideal for use in environments with elevated temperatures, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in cold environments, making this IC suitable for industrial applications where temperature fluctuations are common.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets stringent requirements for reliability and durability, making it suitable for harsh operational settings.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making this IC energy-efficient while maintaining rapid performance.

No. of Segments: 80

With 80 segments available, this IC offers a high level of detail and versatility, allowing for complex representations in products ranging from simple indicators to advanced displays.

Technical Specifications

Other Function Interface ICs PCF2119DU/2/2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

18-BP

No. of Segments:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.5/5.5,2.2/6.5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF2119DU/2/2Z Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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