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NE578N

NXP Semiconductors

NE578N by NXP Semiconductors

NE578N by NXP Semiconductors is a dual-terminal compander in a rectangular plastic/epoxy package, ideal for audio signal processing. It features 16 terminals, a max height of 4.2 mm, and operates within commercial temperature grades. Perfect for enhancing dynamic range in communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,628 parts In-Stock

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4,628

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Anansix

USA . 607 parts In-Stock

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607

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Vyrian

USA . 281 parts In-Stock

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281

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Manoshevitz Elec. Sales

Israel . 25 parts In-Stock

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25

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Huijzer Components

Netherlands . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,566 parts In-Stock

1+ parts

$5.500

100+ parts

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1,566

$5.500

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Corphita

USA . 4,132 parts In-Stock

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UNI Independent Distributors

Spain . 1,340 parts In-Stock

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Overview

Elevate your audio processing with the NE578N from NXP Semiconductors, a trusted leader in analog technology. This high-quality compander excels in enhancing sound clarity and reducing noise, making it ideal for applications in telecommunications, audio equipment, and more. With its robust design and reliable performance, the NE578N ensures superior functionality, delivering exceptional value that empowers your innovative projects to stand out. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protects the internal components from external environmental factors, enhancing the product's reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on PCB layouts, allowing for more compact designs while maintaining performance.

No. of Terminals: 16

With 16 terminals, this IC offers versatile connectivity options for various applications, facilitating integration into complex circuits.

Package Style (Meter): IN-LINE

The in-line package style allows for easier assembly on surface-mounted and through-hole PCBs, improving manufacturing efficiency.

Terminal Position: DUAL

Dual terminal positioning enhances PCB layout flexibility, enabling easier routing and connectivity in circuit designs.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm allows for compatibility with low-profile designs, making it suitable for compact applications.

Width (mm): 7.62 mm

The compact width of 7.62 mm minimizes board space usage, enabling high-density circuit designs without sacrificing performance.

Other IC type: COMPANDER

As a compander, this IC helps optimize dynamic range in audio applications, improving sound quality while reducing noise.

Length: 19.025 mm

The length of 19.025 mm provides a balance between size and performance, making it suitable for a wide range of electronic applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in a variety of everyday environments, making this IC a good choice for general applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and are preferred for prototyping and applications requiring higher durability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, facilitating compatibility with existing designs and simplifying manufacturing.

Technical Specifications

Analog Computational NE578N attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

Length:

19.025 mm

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NE578N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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