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NE572D

NXP Semiconductors

NE572D by NXP Semiconductors

NE572D by NXP Semiconductors is a compact analog compander in a 16-terminal SO package, measuring 9.9 mm x 3.9 mm with a max height of 1.75 mm. It features dual terminal positioning and operates within commercial temperature grades. Ideal for audio processing applications, it enhances signal quality efficiently.

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 278 parts In-Stock

1+ parts

$3.080

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278

$3.080

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DF Sales Co.

USA . 278 parts In-Stock

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$3.080

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278

$3.080

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Digiode

USA . 3,815 parts In-Stock

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3,815

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Anansix

USA . 2,230 parts In-Stock

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2,230

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Avant Electronics Limited

UK . 304 parts In-Stock

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304

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Vyrian

USA . 121 parts In-Stock

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121

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Sinequanon

UK . 94 parts In-Stock

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94

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Prism Electronics

USA . 17 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 15 parts In-Stock

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15

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Semi Source

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 414 parts In-Stock

1+ parts

$5.500

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414

$5.500

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UNI Independent Distributors

Spain . 7,331 parts In-Stock

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Corphita

USA . 1,606 parts In-Stock

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Perfect Parts

USA . 19 parts In-Stock

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Assy Fe

Spain . 15 parts In-Stock

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Overview

Unlock the potential of your audio applications with the NE572D from NXP Semiconductors, where innovative design meets unrivaled quality. This compact analog computational device enhances sound clarity and dynamic range, making it ideal for everything from telecommunications to consumer electronics. Trust in NXP’s renowned expertise to deliver reliable performance, ensuring your projects not only meet but exceed expectations—experience the difference in every note!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on PCBs, enabling compact design and easy integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized footprint for straightforward PCB layout and assembly.

No. of Terminals: 16

Having 16 terminals offers flexibility in circuit design, allowing for more input/output options.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in achieving a reduced overall size, beneficial for space-constrained applications.

Terminal Position: DUAL

Dual terminal positioning enhances layout options and can simplify routing in PCB designs.

Maximum Seated Height: 1.75 mm

A low maximum seated height helps in reducing the profile of the overall assembly, making it suitable for slim devices.

Width (mm): 3.9 mm

A narrow width allows for high-density layouts, making it easier to design compact circuits.

Other IC type: COMPANDER

The compander functionality makes this IC ideal for audio applications, enabling improved dynamic range management.

Length: 9.9 mm

The short length contributes to a compact design, which can be critical in miniaturized electronics.

Temperature Grade: COMMERCIAL

This temperature grade ensures reliable performance under standard operating conditions for general consumer applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering contact and mechanical stability, improving the reliability of the component.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between soldering ease and pin density, accommodating various PCB designs.

Technical Specifications

Analog Computational NE572D attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE572D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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