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NE577D-T

NXP Semiconductors

NE577D-T by NXP Semiconductors

NE577D-T by NXP Semiconductors is a compact analog compander in a 14-terminal SO package, measuring 8.65 mm x 3.9 mm with a max height of 1.75 mm. It features dual terminal positioning and operates within commercial temperature grades. Ideal for audio processing applications, it enhances signal quality efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,938 parts In-Stock

1+ parts

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3,938

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Vyrian

USA . 2,309 parts In-Stock

1+ parts

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2,309

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Anansix

USA . 1,579 parts In-Stock

1+ parts

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1,579

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,254 parts In-Stock

1+ parts

$3.500

100+ parts

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1k+ parts

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1,254

$3.500

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UNI Independent Distributors

Spain . 2,758 parts In-Stock

1+ parts

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2,758

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Corphita

USA . 2,108 parts In-Stock

1+ parts

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2,108

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Overview

Unlock unparalleled audio performance with the NE577D-T from NXP Semiconductors. Renowned for its exceptional quality and reliability, this compander chip is perfect for enhancing voice clarity in telecommunications and reducing noise in audio systems. Its compact design ensures seamless integration into various applications, delivering superior sound quality while optimizing space. Experience the unmatched value of NXP’s expertise—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and thermal stability, making this product suitable for a wide range of applications.

Surface Mount: YES

Being surface mount allows for efficient PCB space utilization, making it easier to design compact circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape aids in providing a uniform footprint on PCBs, facilitating easy placement and alignment during assembly.

No. of Terminals: 14

With 14 terminals, this product supports versatile configurations and ensures robust connectivity for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures minimal real estate on circuit boards, ideal for space-constrained designs.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design, allowing for optimized layouts and improved signal integrity.

Maximum Seated Height: 1.75 mm

A low maximum seated height allows for better integration into low-profile designs, enhancing the overall product's adaptability.

Width: 3.9 mm

At a width of 3.9 mm, this product is well-suited for compact applications where space is a premium.

Other IC type: COMPANDER

As a compander, this product is ideal for audio processing and signal conditioning, making it a valuable choice for communication applications.

Length: 8.65 mm

The length of 8.65 mm supports the compact design needed in modern electronics, ensuring better efficiency in space utilization.

Temperature Grade: COMMERCIAL

Designed for commercial temperature grades, this IC is reliable for everyday applications without requiring extreme environmental conditions.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and easy soldering, making assembly straightforward and reducing production time.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this IC strikes a balance between compactness and ease of soldering, enhancing manufacturing efficiency.

Technical Specifications

Analog Computational NE577D-T attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE577D-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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