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NE578D

NXP Semiconductors

NE578D by NXP Semiconductors

NE578D by NXP Semiconductors is a compact analog compander in a 16-terminal SO package, measuring 9.9 mm x 3.9 mm. It features a max height of 1.75 mm and operates in commercial temperature ranges. Ideal for audio processing applications, it enhances signal quality efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,452 parts In-Stock

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3,452

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Vyrian

USA . 1,690 parts In-Stock

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1,690

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Anansix

USA . 720 parts In-Stock

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720

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Distributors (Availability)

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One Stop Electronics

USA . 1,188 parts In-Stock

1+ parts

$4.500

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1,188

$4.500

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UNI Independent Distributors

Spain . 1,758 parts In-Stock

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1,758

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Metaverse IC Inc.

Canada . 276 parts In-Stock

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276

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Kepictronics

USA . 180 parts In-Stock

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180

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Corphita

USA . 57 parts In-Stock

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57

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Overview

Elevate your audio experience with the NE578D from NXP Semiconductors, a trusted name in analog solutions. This compact compander offers exceptional audio quality and efficiency for diverse applications, from professional sound systems to consumer electronics. With its robust design and superior performance, the NE578D ensures seamless integration and reliability, empowering customers with enhanced sound clarity and dynamic range. Unlock new possibilities in your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection from environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, enabling more compact designs and higher circuit density.

Package Shape: RECTANGULAR

The rectangular shape is optimal for standard PCB layouts, facilitating easy integration into existing designs.

No. of Terminals: 16

With 16 terminals, this IC provides enough connectivity options for complex applications while maintaining ease of use.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements on the board, making it ideal for compact devices.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity and routing flexibility on the PCB, reducing the risk of interference.

Maximum Seated Height: 1.75 mm

A low seated height allows for thinner designs, contributing to the overall compactness of the product.

Width (mm): 3.9 mm

The narrow width makes it compatible with tight designs, allowing for greater layout flexibility.

Other IC type: COMPANDER

Being a compander, this IC is crucial for audio applications, enabling efficient signal compression and expansion.

Length: 9.9 mm

At a length of 9.9 mm, this IC strikes a balance between functionality and size, suitable for most compact designs.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this product is reliable for standard operational environments without extreme conditions.

Terminal Form: GULL WING

Gull wing terminals provide superior soldering properties and mechanical stability, ensuring a secure connection on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density layouts while maintaining ease of soldering and mechanical reliability.

Technical Specifications

Analog Computational NE578D attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE578D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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