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NE577N

NXP Semiconductors

NE577N by NXP Semiconductors

NE577N by NXP Semiconductors is a dual-terminal compander in a rectangular plastic/epoxy package, ideal for audio processing. It features 14 terminals, a max height of 4.2 mm, and operates within commercial temperature grades. Perfect for enhancing dynamic range in analog applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,714 parts In-Stock

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4,714

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Anansix

USA . 2,869 parts In-Stock

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2,869

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Digiode

USA . 1,896 parts In-Stock

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1,896

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Electronic Expediters

USA . 5 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,495 parts In-Stock

1+ parts

$2.500

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1,495

$2.500

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UNI Independent Distributors

Spain . 1,983 parts In-Stock

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1,983

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Corphita

USA . 820 parts In-Stock

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Assy Fe

Spain . 8 parts In-Stock

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Overview

Experience unparalleled audio performance with the NE577N from NXP Semiconductors, a trusted leader in analog technology. This robust compander is designed to enhance sound quality across various applications, delivering crystal-clear audio while minimizing noise. Its durable, user-friendly design ensures reliability and ease of integration into your projects. Elevate your audio solutions with the NE577N—where superior craftsmanship meets exceptional value for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space while accommodating various layout designs, optimizing placement in your circuit.

No. of Terminals: 14

With 14 terminals, the product provides versatile connectivity options for both input and output, facilitating complex circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies integration into existing designs and enhances heat dissipation, crucial for maintaining performance.

Terminal Position: DUAL

Having dual terminal positions improves accessibility for soldering and connections, ensuring reliable electrical interfaces.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm allows for compatibility with low-profile applications, making it suitable for compact designs.

Width: 7.62 mm

A width of 7.62 mm enables efficient use of PCB space while maintaining a robust structure for electrical performance.

Other IC type: COMPANDER

As a compander IC, it is optimized for audio signal processing, providing high-quality performance in sound applications and improving dynamic range.

Length: 19.025 mm

The length of 19.025 mm strikes a balance between compactness and enough physical space for reliable terminal connections.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates suitability for a wide range of consumer applications, ensuring consistent performance under typical conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical strength and provide robust connections, making the product reliable for long-term use.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm standardizes integration with various PCBs, simplifying manufacturing and assembly processes.

Technical Specifications

Analog Computational NE577N attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NE577N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-360-6844, 5962013606844

NIIN

013606844

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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