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TL441CNP3

Texas Instruments

TL441CNP3 by Texas Instruments

TL441CNP3 by Texas Instruments is an Analog Computational IC with +-6V power supplies, 16 terminals, and a temperature range of 0-70°C. It is used as a log or antilog amplifier in commercial-grade applications requiring bipolar technology and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,735 parts In-Stock

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4,735

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Vyrian

USA . 3,119 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 790 parts In-Stock

1+ parts

$0.500

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-

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790

$0.500

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Semicontronic

India . 624 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

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$3.395

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624

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 1,528 parts In-Stock

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$5.500

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1,528

$5.500

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AZTECH Wire

Italy . 195 parts In-Stock

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$6.204

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195

$6.204

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Parana Technologies

USA . 464 parts In-Stock

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$6.998

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$7.563

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464

$6.998

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$7.563

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ChromeModa Solutions

Germany . 1,460 parts In-Stock

1+ parts

$7.863

100+ parts

$6.448

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1,460

$7.863

$6.448

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IDEA Electronic Components Group

UK . 1,430 parts In-Stock

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$7.863

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$7.077

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1,430

$7.863

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$7.077

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Corphita

USA . 4,111 parts In-Stock

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DigiPath Technology Company

USA . 2,164 parts In-Stock

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$7.089

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2,164

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$7.089

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Corohmni

South Africa . 239 parts In-Stock

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Overview

Unlock the full potential of your analog computational projects with the TL441CNP3 by Texas Instruments. Renowned for their exceptional quality and reliability, Texas Instruments offers a wide range of innovative solutions for various applications in the analog computational category. The TL441CNP3, with its advanced features and robust design, provides unparalleled value to customers seeking precision and accuracy in their designs. Experience the benefits of superior performance and efficiency with Texas Instruments, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Nominal Supply Voltage (Vsup): 6 V

Having a nominal supply voltage of 6V allows for compatibility with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature conditions, enhancing its reliability and functionality in different environments.

Technology: BIPOLAR

The use of bipolar technology ensures high precision and accuracy in computations, making this product a suitable choice for analog computational tasks.

Nominal Negative Supply Voltage (Vsup): -6 V

The availability of a negative supply voltage of -6V allows for bipolar operation and expands the range of possible computations, increasing the versatility of this product.

Technical Specifications

Analog Computational TL441CNP3 attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

Nominal Negative Supply Voltage (Vsup):

-6 V

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-6

Sub-Category:

Analog Computational Functions

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TL441CNP3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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