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TL441MJ

Texas Instruments

TL441MJ by Texas Instruments

TL441MJ by Texas Instruments is a MILITARY-grade LOG/ANTILOG AMPLIFIER with 16 terminals, BIPOLAR technology, and 40 kHz bandwidth. It operates b/w -55°C to 125°C, with +-6V power supplies suitable for various analog computational applications. The package style is IN-LINE ceramic rectangular shape with through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,754 parts In-Stock

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Digiode

USA . 130 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 65 parts In-Stock

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Holdelec - ElecDif-Pro

France . 65 parts In-Stock

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LittleDiode

UK . 8 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 3 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 240 parts In-Stock

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$3.500

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240

$3.500

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AZTECH Wire

Italy . 521 parts In-Stock

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$15.707

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Parana Technologies

USA . 2,129 parts In-Stock

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$20.701

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$20.826

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$20.701

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DigiPath Technology Company

USA . 2,015 parts In-Stock

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$22.794

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$20.970

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$22.794

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ChromeModa Solutions

Germany . 3,484 parts In-Stock

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$23.259

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$19.072

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IDEA Electronic Components Group

UK . 278 parts In-Stock

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$23.259

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$22.096

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$20.933

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Corphita

USA . 2,590 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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Overview

Experience unparalleled precision and performance with the TL441MJ by Texas Instruments. As a leader in analog computational technology, Texas Instruments delivers superior quality and reliability in every product. The TL441MJ offers a wide range of applications in various industries, providing unmatched value and benefits to customers. Whether you're in need of a high-performance log or antilog amplifier, this military-grade IC is the perfect solution for your needs. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent heat dissipation and is resistant to high temperatures, making it ideal for use in rugged environments or high-performance applications.

Nominal Supply Voltage (Vsup): 6 V

Operating at a 6V supply voltage allows for compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extended periods of operation without overheating.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precision, making it suitable for applications requiring accurate analog computations.

Nominal Bandwidth: 40 kHz

The 40 kHz nominal bandwidth enables fast and efficient signal processing, making this product suitable for applications that require real-time analog computations.

Technical Specifications

Analog Computational TL441MJ attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

40 kHz

JESD-30 Code:

R-XDIP-T16

Nominal Negative Supply Voltage (Vsup):

-6 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-6

Qualification:

Not Qualified

Sub-Category:

Analog Computational Functions

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TL441MJ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-001-5843, 5962000015843

NIIN

000015843

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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