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TL441AMJB

Texas Instruments

TL441AMJB by Texas Instruments

TL441AMJB by Texas Instruments is an Analog Computational IC with 16 terminals, operating at -55 to 125 °C. It features a supply voltage range of +-6 V, bandwidth of 40 kHz, and MILITARY temperature grade. Ideal for LOG OR ANTILOG AMPLIFIER applications due to its BIPOLAR technology and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,703 parts In-Stock

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Cyclops Electronics Ltd

UK . 238 parts In-Stock

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Digiode

USA . 219 parts In-Stock

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Electronics Depot

USA . 60 parts In-Stock

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Sogenti Electronics

Canada . 8 parts In-Stock

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Electronic Expediters

USA . 7 parts In-Stock

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Speed Components Ltd

Israel . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 774 parts In-Stock

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$1.500

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774

$1.500

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Parana Technologies

USA . 1,526 parts In-Stock

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$1.771

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$2.338

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ChromeModa Solutions

Germany . 2,372 parts In-Stock

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$1.990

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$1.632

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IDEA Electronic Components Group

UK . 1,443 parts In-Stock

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$1.990

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$1.791

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One Stop Electronics

USA . 1,329 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 762 parts In-Stock

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$18.241

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Kepictronics

USA . 15,000 parts In-Stock

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Lixinc

USA . 14,593 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$1.794

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Microchip USA

USA . 1,464 parts In-Stock

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Corphita

USA . 1,441 parts In-Stock

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Overview

Unleash the power of precision with the TL441AMJB by Texas Instruments, a top-tier leader in analog computational technology. This rectangular package offers unparalleled accuracy and reliability for a wide range of applications. With a military-grade temperature rating and dual terminal position, this IC type is perfect for demanding environments. Experience the seamless integration and exceptional performance that Texas Instruments is known for, all while achieving optimal results and maximizing efficiency. Elevate your projects to new heights with the TL441AMJB – where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring longevity and reliability in various operating conditions.

Nominal Supply Voltage (Vsup): 6 V

Suitable for a wide range of applications that require stable power input at 6V.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in industrial and military applications.

Width (mm): 7.62 mm

Compact size allows for easy integration into different systems and PCB designs.

Technology: BIPOLAR

Utilizes bipolar technology for accurate and precise analog computations, ensuring high performance.

Technical Specifications

Analog Computational TL441AMJB attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

40 kHz

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Nominal Negative Supply Voltage (Vsup):

-6 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

23 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

-6 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TL441AMJB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-226-9798, 5962012269798

NIIN

012269798

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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