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TL441MJ/883B

Texas Instruments

TL441MJ/883B by Texas Instruments

TL441MJ/883B by Texas Instruments is a MIL-STD-883 Class B Analog Computational IC with 16 terminals. It operates at temperatures from -55 to 125 °C, with a bandwidth of 40 kHz. Ideal for military applications requiring bipolar technology and log or antilog amplification in ceramic package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 8,199 parts In-Stock

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Digiode

USA . 673 parts In-Stock

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Resion

USA . 311 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 23 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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One Stop Electronics

USA . 1,438 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 797 parts In-Stock

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$8.422

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Parana Technologies

USA . 316 parts In-Stock

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$12.138

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$12.548

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DigiPath Technology Company

USA . 1,288 parts In-Stock

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$13.365

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$12.296

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ChromeModa Solutions

Germany . 6,967 parts In-Stock

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$13.638

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$11.183

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

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$13.638

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$12.956

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$12.274

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Corphita

USA . 1,718 parts In-Stock

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Overview

Discover the superior quality and precision of the TL441MJ/883B by Texas Instruments, a top-tier manufacturer renowned for excellence in analog computational technology. This military-grade log or antilog amplifier offers unparalleled performance and reliability in a wide range of applications. With its ceramic package body material and MIL-STD-883 Class B screening level, this rectangular package style IC is designed to excel in harsh environments. Experience the value and benefits of this innovative product, delivering exceptional results with a nominal bandwidth of 40 kHz and dual terminal position for seamless integration.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and resistance to high temperatures, ensuring the product's durability and reliability in harsh environments.

Screening Level: MIL-STD-883 Class B (Modified)

The MIL-STD-883 Class B screening level ensures that the product meets stringent quality and reliability standards, making it suitable for critical military and aerospace applications.

Nominal Supply Voltage (Vsup): 6 V

The 6V supply voltage allows for efficient power management and compatibility with a wide range of systems, offering flexibility in application.

Power Supplies (V): +-6

Having dual power supplies of +-6V enables bipolar operation and increased signal processing capabilities, making the product versatile for various analog computational tasks.

No. of Terminals: 16

With 16 terminals, the product offers ample connectivity options and simplifies the integration process in complex circuit designs.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy installation and troubleshooting, making it convenient for maintenance and service personnel.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures stable performance even in demanding thermal conditions, increasing the product's reliability in extreme environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the product to function effectively in cold environments, providing consistent performance across a wide temperature range.

Temperature Grade: MILITARY

The military-grade temperature specification indicates that the product meets stringent reliability and performance standards required for mission-critical military applications.

Technology: BIPOLAR

Utilizing bipolar technology enhances the product's signal processing capabilities and accuracy, making it suitable for precision analog computations and applications that require high-speed performance.

Technical Specifications

Analog Computational TL441MJ/883B attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

40 kHz

JESD-30 Code:

R-XDIP-T16

Nominal Negative Supply Voltage (Vsup):

-6 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Analog Computational Functions

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TL441MJ/883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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