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TL441CNSRE4

Texas Instruments

TL441CNSRE4 by Texas Instruments

TL441CNSRE4 by Texas Instruments is a dual-function analog computational IC with a nominal voltage of +-6V and 40 kHz nominal bandwidth. It is used as a log or antilog amplifier in commercial-grade applications, featuring a small outline package style and gull wing terminal form for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,228 parts In-Stock

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2,228

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Digiode

USA . 1,809 parts In-Stock

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1,809

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Distributors (Availability)

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One Stop Electronics

USA . 1,580 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,580

$4.500

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Ampacity Inc.

Singapore . 658 parts In-Stock

1+ parts

$5.500

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658

$5.500

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Semicontronic

India . 1,307 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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1,307

$7.500

$7.312

$7.275

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Parana Technologies

USA . 479 parts In-Stock

1+ parts

$7.901

100+ parts

-

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$8.458

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479

$7.901

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$8.458

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DigiPath Technology Company

USA . 702 parts In-Stock

1+ parts

$8.700

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702

$8.700

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ChromeModa Solutions

Germany . 6,607 parts In-Stock

1+ parts

$8.878

100+ parts

$7.280

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6,607

$8.878

$7.280

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IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$8.878

100+ parts

$8.434

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$7.990

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475

$8.878

$8.434

$7.990

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AZTECH Wire

Italy . 747 parts In-Stock

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$17.701

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747

$17.701

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Corphita

USA . 2,665 parts In-Stock

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2,665

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Corohmni

South Africa . 325 parts In-Stock

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Overview

Elevate your analog computational projects with the TL441CNSRE4 by Texas Instruments. Crafted with precision and excellence, this small outline package offers a myriad of applications in various industries. With a nominal bandwidth of 40 kHz and a nominal supply voltage of 6V, this dual-functional IC delivers unrivaled performance. Experience seamless operation and increased efficiency with the TL441CNSRE4, designed to meet your needs and exceed your expectations. Elevate your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside the package, ensuring high reliability and durability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

No. of Functions: 2

This product offers multiple functions in a single package, reducing the need for additional components and simplifying circuit design.

Nominal Supply Voltage (Vsup): 6 V

The specified supply voltage ensures proper operation and compatibility with standard power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable operation in various environmental conditions, increasing product versatility.

Technology: BIPOLAR

The bipolar technology used in this product offers high performance and accuracy in signal processing applications.

Technical Specifications

Analog Computational TL441CNSRE4 attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

40 kHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage (Vsup):

-6 V

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

23 mA

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.3 mm

Trade Compliance

TL441CNSRE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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