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NE577D

NXP Semiconductors

NE577D by NXP Semiconductors

NE577D by NXP Semiconductors is a compact analog compander in a 14-terminal SO package, measuring 8.65 mm x 3.9 mm. It features a max seated height of 1.75 mm and operates within commercial temperature grades. Ideal for audio signal processing applications, it enhances sound quality efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,069 parts In-Stock

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3,069

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Vyrian

USA . 2,189 parts In-Stock

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Anansix

USA . 1,685 parts In-Stock

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1,685

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Sunrise Surplus Inc.

USA . 182 parts In-Stock

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MISTER SPROCKETS

USA . 12 parts In-Stock

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One Stop Electronics

USA . 1,145 parts In-Stock

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$4.500

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$4.500

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UNI Independent Distributors

Spain . 6,389 parts In-Stock

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6,389

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Corphita

USA . 4,278 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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90

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Overview

Elevate your audio quality with the NE577D from NXP Semiconductors, a trusted leader in innovative solutions. This compander delivers exceptional performance in analog applications, ensuring crystal-clear sound and reduced noise. Its compact design makes it perfect for space-constrained projects, while NXP's commitment to reliability guarantees long-lasting value. Experience enhanced audio clarity that transforms your products into superior sound experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material contributes to the durability and cost-effectiveness of the product, making it ideal for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB and allows for higher density layouts.

No. of Terminals: 14

With 14 terminals, this IC facilitates versatile connectivity options, enhancing its functionality in different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design, which is especially beneficial in applications with size constraints.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility on the PCB, supporting better routing options for signal integrity.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures compatibility with low-profile applications, allowing for more versatile placements.

Width: 3.9 mm

The narrow width contributes to space savings on the PCB, enabling designers to optimize circuit layouts more effectively.

Other IC type: COMPANDER

As a compander, this IC is valuable in audio applications, reducing the dynamic range for better signal quality.

Length: 8.65 mm

A compact length enhances layout flexibility and fitting into various electronic designs while maintaining robustness.

Temperature Grade: COMMERCIAL

Commercial temperature grading allows for a wide range of usage in various environments, ensuring reliability and performance.

Terminal Form: GULL WING

Gull-wing terminals facilitate efficient soldering and provide reliable electrical connections, enhancing overall product performance.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a common standard in the industry, ensuring compatibility with various PCB designs and manufacturing processes.

Technical Specifications

Analog Computational NE577D attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE577D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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