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NE576D

NXP Semiconductors

NE576D by NXP Semiconductors

COMPANDER; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,652 parts In-Stock

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Digiode

USA . 3,603 parts In-Stock

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Anansix

USA . 2,028 parts In-Stock

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Cyclops Electronics Ltd

UK . 950 parts In-Stock

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Legend Electronics Inc.

USA . 86 parts In-Stock

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R&J Components

USA . 36 parts In-Stock

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One Stop Electronics

USA . 309 parts In-Stock

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$0.500

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,912 parts In-Stock

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Assy Fe

Spain . 4,560 parts In-Stock

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Corphita

USA . 4,308 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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Perfect Parts

USA . 1,064 parts In-Stock

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Technical Specifications

Analog Computational NE576D attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE576D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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