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NE572D-T

NXP Semiconductors

NE572D-T by NXP Semiconductors

NE572D-T by NXP Semiconductors is a compact analog compander in a 16-terminal SO package, measuring 9.9 mm x 3.9 mm. It features a max height of 1.75 mm and operates within commercial temperature grades. Ideal for audio processing applications, it enhances signal quality efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,498 parts In-Stock

1+ parts

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4,498

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Digiode

USA . 3,977 parts In-Stock

1+ parts

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3,977

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Anansix

USA . 1,082 parts In-Stock

1+ parts

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1,082

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,146 parts In-Stock

1+ parts

$3.500

100+ parts

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1k+ parts

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1,146

$3.500

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UNI Independent Distributors

Spain . 4,327 parts In-Stock

1+ parts

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4,327

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Corphita

USA . 2,994 parts In-Stock

1+ parts

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2,994

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Overview

Unlock the potential of your audio applications with the NE572D-T from NXP Semiconductors, a leader in innovative solutions. This high-quality compander offers exceptional performance and reliability, enhancing audio clarity in diverse environments. Its compact design and surface mount capability make integration seamless, providing you with unparalleled flexibility. Elevate your projects with NXP's trusted technology and experience superior sound quality that keeps your audience captivated!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making this product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern circuit boards, enhancing space efficiency and overall performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout flexibility and compatibility with various PCB designs, ensuring better usage of board space.

No. of Terminals: 16

With 16 terminals, this compander can handle multiple inputs and outputs, providing versatility for complex analog computations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for high-performance applications while minimizing the footprint on a circuit board.

Terminal Position: DUAL

Dual terminal positioning supports efficient layout design and better connectivity options in multi-layer circuit boards.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a slim profile, making it suitable for compact devices where space is at a premium.

Width: 3.9 mm

This narrow width makes it ideal for high-density circuit designs, allowing integration into smaller electronic devices.

Other IC type: COMPANDER

As a compander, this IC effectively manages audio signals, enhancing sound quality in various audio applications.

Length: 9.9 mm

This length strikes a balance between performance and space requirements, making it suitable for a wide range of electronic applications.

Temperature Grade: COMMERCIAL

Designed for commercial temperature grades, this product is reliable for standard operating conditions in consumer electronics.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, enhancing manufacturing efficiency and reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm helps to provide a stable connection while allowing for high-density designs in compact applications.

Technical Specifications

Analog Computational NE572D-T attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE572D-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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