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AD632TD/883B

Analog Devices

AD632TD/883B by Analog Devices

ANALOG MULTIPLIER OR DIVIDER; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

$293.330

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Analog Devices Inc

USA . 200 parts In-Stock

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$293.330

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$176.000

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Digiode

USA . 446 parts In-Stock

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$242.316

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Vyrian

USA . 6,926 parts In-Stock

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Chip Stock

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Resion

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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Parana Technologies

USA . 1,032 parts In-Stock

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$12.418

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$11.549

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$12.418

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

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$13.353

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$12.685

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$12.685

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$12.685

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DigiPath Technology Company

USA . 788 parts In-Stock

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$20.831

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$19.997

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$19.997

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$19.997

Vigor

Singapore . 523 parts In-Stock

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$147.450

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One Stop Electronics

USA . 51 parts In-Stock

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$216.810

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Corphita

USA . 1,415 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Microchip USA

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Northwest PG Solutions

USA . 2,198 parts In-Stock

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Native Components

USA . 573 parts In-Stock

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Technical Specifications

Analog Computational AD632TD/883B attributes and parameters. Explore more Analog Computational devices from Analog Devices

Specs

Nominal Bandwidth:

1 kHz

JESD-30 Code:

R-CDIP-T14

JESD-609 Code:

e0

Length:

18.885 mm

Maximum Negative Supply Voltage (Vsup):

-22 V

Minimum Negative Supply Voltage (Vsup):

-8 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Input Voltage:

-10 V

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Positive Input Voltage:

10 V

Power Supplies (V):

+-15

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.95 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

AD632TD/883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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