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SA571DG

Onsemi

SA571DG by Onsemi

SA571DG by Onsemi is an Analog Computational IC with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of 6-18V and a bandwidth of 0.02 kHz. Ideal for industrial applications requiring compact design and low power consumption.

Median Price

$3.260

Lifecycle Status

Suppliers In-Stock

8

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1k+

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Arrow

USA . 30 parts In-Stock

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$3.560

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$2.960

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$2.822

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30

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Verical

USA . 30 parts In-Stock

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$2.960

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$2.822

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Digiode

USA . 664 parts In-Stock

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$3.283

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Vyrian

USA . 3,865 parts In-Stock

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J2 Sourcing AB

Sweden . 147 parts In-Stock

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ComSIT Distribution GmbH

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Semi Source

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LIBRA Elektronik GmbH

Germany . 45 parts In-Stock

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Corphita

USA . 1,082 parts In-Stock

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$3.110

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Corohmni

South Africa . 434 parts In-Stock

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$3.310

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AZTECH Wire

Italy . 967 parts In-Stock

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$17.910

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Microchip USA

USA . 9,577 parts In-Stock

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SupplyDigital Components

Austria . 8,184 parts In-Stock

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TANS Electronics

Latvia . 5,894 parts In-Stock

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Vigor

Singapore . 4,771 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Perfect Parts

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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Continental Prestige Electronics

USA . 46 parts In-Stock

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$2.600

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Overview

Enhance your analog computational projects with the SA571DG by Onsemi, a high-quality product that offers unparalleled reliability and performance. Manufactured by Onsemi, a leader in innovative semiconductor solutions, this compander IC is ideal for a wide range of applications. With its small outline package design, dual terminals, and wide temperature range, the SA571DG provides exceptional value and versatility. Upgrade your designs today with the SA571DG and experience the benefits of superior quality and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards and saves space, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 15 V

Operating at a nominal supply voltage of 15V provides stable performance and compatibility with standard power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, making it suitable for industrial applications.

Technology: BIPOLAR

Utilizing bipolar technology ensures reliable and accurate analog computations, making it a good choice for precision applications.

Technical Specifications

Analog Computational SA571DG attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

Nominal Bandwidth:

.02 kHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

4.8 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

SA571DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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