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SA575DTBR2G

Onsemi

SA575DTBR2G by Onsemi

SA575DTBR2G by Onsemi is an analog computational IC with 2 functions. It operates at a nominal voltage of 5V and has a small outline, thin profile package style. It is commonly used in industrial applications requiring companding capabilities.

Median Price

$0.881

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,430 parts In-Stock

1+ parts

$1.270

100+ parts

$0.737

1k+ parts

$0.641

10k+ parts

$0.596

2,430

$1.270

$0.737

$0.641

$0.596

Mouser Electronics

USA . 2,288 parts In-Stock

1+ parts

$1.270

100+ parts

$0.738

1k+ parts

$0.642

10k+ parts

$0.586

2,288

$1.270

$0.738

$0.642

$0.586

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.492

2,500

-

-

-

$0.492

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.492

2,500

-

-

-

$0.492

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$2.860

-

-

-

NAC Semi

USA . 230,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.507

230,000

-

-

-

$0.507

Chip Stock

USA . 14,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

14,154

-

-

-

-

Flip Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

-

-

-

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Vyrian

USA . 469 parts In-Stock

1+ parts

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-

1k+ parts

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469

-

-

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Digiode

USA . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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208

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 708 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

708

$2.500

-

-

-

Corohmni

South Africa . 155 parts In-Stock

1+ parts

$2.803

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$2.803

-

-

-

Argo Parts USA

USA . 3,274 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

3,274

$2.860

-

-

-

Continental Prestige Electronics

USA . 2,077 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

$2.803

2,077

$2.860

-

-

$2.803

Netroflash

USA . 500 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.860

-

-

-

Aztec Data Supply Inc.

USA . 1,603 parts In-Stock

1+ parts

$7.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,603

$7.035

-

-

-

Semicontronic

India . 162 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

162

$7.500

$7.312

$7.275

-

Modulus Dynamics

Lithuania . 5,192 parts In-Stock

1+ parts

$13.434

100+ parts

$13.434

1k+ parts

$13.434

10k+ parts

-

5,192

$13.434

$13.434

$13.434

-

Perfect Parts

USA . 104,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

104,270

-

-

-

-

Lixinc

USA . 14,856 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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-

14,856

-

-

-

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Kepictronics

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,500

-

-

-

-

RC Electronics

USA . 9,031 parts In-Stock

1+ parts

-

100+ parts

$2.920

1k+ parts

$2.660

10k+ parts

$2.580

9,031

-

$2.920

$2.660

$2.580

TANS Electronics

Latvia . 6,413 parts In-Stock

1+ parts

-

100+ parts

-

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-

6,413

-

-

-

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Assy Fe

Spain . 5,805 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,805

-

-

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SupplyDigital Components

Austria . 2,572 parts In-Stock

1+ parts

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100+ parts

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2,572

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Microchip USA

USA . 2,501 parts In-Stock

1+ parts

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100+ parts

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2,501

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

-

-

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Kulean Microsystems

USA . 1,024 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,024

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-

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UHIMA Technologies

Türkiye . 735 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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735

-

-

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Problanco Electronics

Mexico . 418 parts In-Stock

1+ parts

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100+ parts

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418

-

-

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Corphita

USA . 136 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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136

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-

Overview

Experience exceptional analog computational capabilities with the SA575DTBR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This compact rectangular package offers a range of applications in various industries. With its small outline, thin profile, and shrink pitch package style, it is easy to integrate into any design. Benefit from its dual terminal position and gull wing terminal form for seamless connectivity. Enjoy a nominal supply voltage of 5V and a wide temperature range of -40 to 85 °C, making it suitable for industrial environments. Unlock new possibilities and elevate your projects with the SA575DTBR2G.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy as the package body material provides durability and protection for the product, making it suitable for a wide range of applications.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation, reducing the need for complex wiring and increasing convenience in the assembly process.

No. of Functions:

2 - With two functions integrated into one product, it offers versatility and can perform multiple tasks, optimizing space and reducing the need for additional components.

Package Shape:

RECTANGULAR - The rectangular shape of the package provides stability and ease of integration into various systems, allowing for efficient utilization of space.

Nominal Supply Voltage (Vsup):

5 V - The nominal supply voltage of 5V ensures compatibility with standard power systems, providing a reliable voltage input for optimal performance.

Power Supplies (V):

5 - The availability of 5 power supplies offers flexibility and compatibility with various power sources, catering to different application requirements.

No. of Terminals:

20 - The presence of 20 terminals enables easy connectivity and integration, allowing for seamless interaction with other components and systems.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style make this product ideal for compact designs, saving space and enhancing portability.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature of 85°C ensures the product's reliability and stability even in demanding conditions, making it suitable for industrial environments.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature of -40°C enables the product to withstand extreme cold environments, expanding its range of applications.

Terminal Finish:

NICKEL PALLADIUM GOLD - The terminal finish of nickel palladium gold provides excellent conductivity, corrosion resistance, and durability, ensuring reliable and long-lasting performance.

Terminal Position:

DUAL - The dual terminal position offers flexibility in circuit integration and a more secure connection, enhancing overall reliability and performance.

Maximum Seated Height:

1.2 mm - The low maximum seated height allows for a compact and streamlined design, making it suitable for space-constrained applications.

Width (mm):

4.4 mm - With a narrow width of 4.4mm, this product provides space-saving characteristics, enabling it to be used in compact devices or systems.

Other IC type:

COMPANDER - The integration of a compander in this product enhances its functionality, enabling effective compression and expansion of analog signals, making it advantageous for audio processing applications.

Minimum Supply Voltage (Vsup):

3 V - The minimum supply voltage of 3V allows for efficient operation in low-power scenarios, optimizing energy consumption and extending battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s):

30 - With a maximum time of 30 seconds at peak reflow temperature, this product offers excellent heat resistance during soldering processes, ensuring reliable solder joints.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature of 260°C allows for effective solder melting and joint formation, meeting industry standards and ensuring reliable connections.

Length:

6.5 mm - The compact length of 6.5mm makes this product suitable for applications with space limitations, promoting efficient and versatile design solutions.

Temperature Grade:

INDUSTRIAL - With an industrial temperature grade rating, this product is designed to withstand harsh operating conditions, ensuring reliable performance in industrial environments.

Maximum Supply Current (Isup):

5.5 mA - The maximum supply current of 5.5mA ensures efficient power consumption, making this product suitable for low-power applications and battery-operated devices.

Nominal Bandwidth:

0.02 kHz - The nominal bandwidth of 0.02kHz indicates that this product is capable of accurately processing signals within this frequency range, making it suitable for specific applications.

Terminal Form:

GULL WING - The gull-wing terminal form allows for easy and reliable soldering, ensuring secure connections and facilitating the efficient assembly of the product.

Terminal Pitch:

0.65 mm - With a terminal pitch of 0.65mm, this product offers compatibility with standard PCB designs and facilitates integration with other components.

Maximum Supply Voltage (Vsup):

7 V - The maximum supply voltage of 7V ensures reliable operation at higher input voltages, accommodating a wider range of power sources.

Maximum Positive Input Voltage:

7 V - The maximum positive input voltage of 7V allows for compatibility with higher voltage analog input signals, enhancing the versatility of this product.

Technical Specifications

Analog Computational SA575DTBR2G attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

Nominal Bandwidth:

.02 kHz

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Positive Input Voltage:

7 V

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

5.5 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

SA575DTBR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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