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SA575DG

Onsemi

SA575DG by Onsemi

SA575DG by Onsemi is an Analog Computational IC with 2 functions, operating at -40 to 85°C. It has a supply voltage range of 3-7V and bandwidth of 0.02 kHz. Ideal for industrial applications requiring companding functionality in a small outline package.

Median Price

$3.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 112 parts In-Stock

1+ parts

$3.660

100+ parts

$3.590

1k+ parts

$3.510

10k+ parts

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112

$3.660

$3.590

$3.510

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Avnet

USA . 8 parts In-Stock

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8

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Nova Conductors

Japan . 87 parts In-Stock

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$4.550

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87

$4.550

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Vyrian

USA . 7,724 parts In-Stock

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Digiode

USA . 1,814 parts In-Stock

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Chip Stock

USA . 183 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 42 parts In-Stock

1+ parts

$2.650

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42

$2.650

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Corohmni

South Africa . 442 parts In-Stock

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$3.120

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Vigor

Singapore . 2,702 parts In-Stock

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$3.590

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2,702

$3.590

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AZTECH Wire

Italy . 192 parts In-Stock

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$8.687

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$8.687

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Component Stockers USA

USA . 444 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 6,582 parts In-Stock

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TANS Electronics

Latvia . 6,200 parts In-Stock

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Kulean Microsystems

USA . 5,349 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 2,742 parts In-Stock

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Perfect Parts

USA . 791 parts In-Stock

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791

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Bastille Electronics

Australia . 382 parts In-Stock

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Microchip USA

USA . 375 parts In-Stock

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Corphita

USA . 315 parts In-Stock

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315

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UHIMA Technologies

Türkiye . 235 parts In-Stock

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Continental Prestige Electronics

USA . 42 parts In-Stock

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$3.020

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42

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$3.020

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Overview

Discover the limitless possibilities with the SA575DG from Onsemi, a leading manufacturer in analog computational technology. Designed for high performance and reliability, this innovative product offers unmatched precision and efficiency in a wide range of applications. Whether you're looking to enhance your audio systems or improve signal processing, the SA575DG delivers exceptional value, benefits, and advantages that will elevate your projects to new heights. Experience the power of superior quality and cutting-edge technology with the SA575DG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, making integration into existing systems easier.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product can perform reliably in extreme cold environments.

Nominal Bandwidth: 0.02 kHz

The nominal bandwidth of 0.02 kHz indicates a low frequency range, suitable for applications requiring precision analog computations.

Technical Specifications

Analog Computational SA575DG attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

Nominal Bandwidth:

.02 kHz

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Positive Input Voltage:

7 V

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

5.5 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.5 mm

Trade Compliance

SA575DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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