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SA571NG

Onsemi

SA571NG by Onsemi

SA571NG by Onsemi is an Analog Computational IC with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of 6-18 V and a bandwidth of 0.02 kHz. Ideal for industrial applications requiring bipolar technology in a compact rectangular package.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 5,394 parts In-Stock

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Digiode

USA . 2,057 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Huijzer Components

Netherlands . 90 parts In-Stock

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Semicontronic

India . 1,572 parts In-Stock

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$2.500

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$2.438

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$2.425

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Corohmni

South Africa . 791 parts In-Stock

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$5.356

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Ampacity Inc.

Singapore . 1,074 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 707 parts In-Stock

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$8.084

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Aztec Data Supply Inc.

USA . 527 parts In-Stock

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$14.404

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Lixinc

USA . 17,815 parts In-Stock

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SupplyDigital Components

Austria . 6,587 parts In-Stock

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Kepictronics

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Continental Prestige Electronics

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Bastille Electronics

Australia . 3,985 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,424 parts In-Stock

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Argo Parts USA

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Vigor

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UHIMA Technologies

Türkiye . 833 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unleash the power of analog computational technology with the SA571NG by Onsemi. This high-quality product offers customers a wide range of applications, from audio processing to communication systems, all while providing superior performance and reliability. With Onsemi's reputation for excellence in manufacturing, you can trust that the SA571NG delivers unmatched value and benefits. Experience the advantages of this innovative product today and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable and long-lasting.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15 V ensures stable and consistent power delivery to the product, allowing it to function effectively.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high heat environments, making it suitable for a variety of applications.

Technology: BIPOLAR

The bipolar technology used in this product provides accurate and precise computations, making it a reliable choice for analog computational tasks.

Nominal Bandwidth: 0.02 kHz

With a nominal bandwidth of 0.02 kHz, this product is capable of processing signals with high frequency accuracy, making it ideal for analog computational tasks.

Technical Specifications

Analog Computational SA571NG attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

Nominal Bandwidth:

.02 kHz

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

4.8 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SA571NG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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