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LOG2112AIDWRE4

Texas Instruments

LOG2112AIDWRE4 by Texas Instruments

LOG2112AIDWRE4 by Texas Instruments is an Analog Computational IC with 16 terminals, operating voltage of +-5V, and temperature range from -40 to 85°C. It serves as a LOG or ANTILOG AMPLIFIER in industrial applications requiring precise signal processing within a compact 10.3mm x 7.5mm package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,986 parts In-Stock

1+ parts

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4,986

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Vyrian

USA . 4,961 parts In-Stock

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4,961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 890 parts In-Stock

1+ parts

$2.500

100+ parts

-

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890

$2.500

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One Stop Electronics

USA . 727 parts In-Stock

1+ parts

$2.500

100+ parts

-

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727

$2.500

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Semicontronic

India . 1,637 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,637

$4.500

$4.388

$4.365

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Parana Technologies

USA . 1,969 parts In-Stock

1+ parts

$7.819

100+ parts

-

1k+ parts

$8.370

10k+ parts

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1,969

$7.819

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$8.370

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DigiPath Technology Company

USA . 225 parts In-Stock

1+ parts

$8.609

100+ parts

$7.921

1k+ parts

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225

$8.609

$7.921

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IDEA Electronic Components Group

UK . 2,280 parts In-Stock

1+ parts

$8.785

100+ parts

$8.346

1k+ parts

$7.906

10k+ parts

-

2,280

$8.785

$8.346

$7.906

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ChromeModa Solutions

Germany . 42 parts In-Stock

1+ parts

$8.785

100+ parts

$7.204

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42

$8.785

$7.204

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AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$12.470

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327

$12.470

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Corphita

USA . 2,862 parts In-Stock

1+ parts

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2,862

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Corohmni

South Africa . 285 parts In-Stock

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285

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Overview

Unlock the power of analog computational technology with the LOG2112AIDWRE4 by Texas Instruments. This small outline package offers a wide range of applications from log or antilog amplification to precision signal processing. With a nominal supply voltage of 5V and a temperature grade of industrial, this device provides reliable performance in even the harshest environments. Experience the quality and expertise of Texas Instruments with the LOG2112AIDWRE4, delivering exceptional value and unmatched benefits to customers seeking top-notch analog computational solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

Nominal Supply Voltage (Vsup): 5 V

Stable supply voltage ensures consistent performance.

No. of Terminals: 16

Sufficient terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without issue.

Technology: BIPOLAR

Utilizes bipolar technology for accurate computations.

Technical Specifications

Analog Computational LOG2112AIDWRE4 attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Supply Voltage (Vsup):

-18 V

Minimum Negative Supply Voltage (Vsup):

-4.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Input Voltage:

-3.8 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Positive Input Voltage:

3.5 V

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

3.5 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

LOG2112AIDWRE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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