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SA572DTB

Onsemi

SA572DTB by Onsemi

SA572DTB by Onsemi is a 2-function analog computational IC with 16 terminals and a supply voltage range of 6-22V. It operates b/w -40 to 85 °C, suitable for industrial applications. The small outline package has a thin profile and shrink pitch, making it ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,493 parts In-Stock

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Digiode

USA . 1,103 parts In-Stock

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AZTECH Wire

Italy . 550 parts In-Stock

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$18.940

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Kulean Microsystems

USA . 4,889 parts In-Stock

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Vigor

Singapore . 4,778 parts In-Stock

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SupplyDigital Components

Austria . 3,176 parts In-Stock

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Problanco Electronics

Mexico . 1,995 parts In-Stock

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TANS Electronics

Latvia . 1,741 parts In-Stock

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Corphita

USA . 553 parts In-Stock

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 234 parts In-Stock

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Overview

Discover the cutting-edge SA572DTB by Onsemi, a top-of-the-line Analog Computational device that offers unparalleled quality and performance. Manufactured by the renowned Onsemi, this product boasts a sleek rectangular design with 16 terminals for maximum versatility. Ideal for a wide range of applications, from industrial automation to audio processing, the SA572DTB provides customers with the value and benefits they need. Experience the advantage of reliable power supplies, dual terminal positions, and a compact design that sets this product apart from the rest. Elevate your projects with the SA572DTB and unleash its full potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for easy handling and protection of the internal components.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving space and enhancing the overall design aesthetics.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15V provides a stable power source for reliable performance and accuracy in computations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and maintain functionality in industrial settings.

Technology: BIPOLAR

The use of bipolar technology offers high precision and low noise in analog computations, making it suitable for applications requiring accurate results.

Technical Specifications

Analog Computational SA572DTB attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

6.3 mA

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

SA572DTB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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