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SA575DR2

Onsemi

SA575DR2 by Onsemi

SA575DR2 by Onsemi is an Analog Computational IC with 2 functions, operating at a supply voltage range of 3-7V. It features a nominal bandwidth of 0.02 kHz and industrial temperature grade suitability. This small outline package is ideal for compander applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,898 parts In-Stock

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Digiode

USA . 1,601 parts In-Stock

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AZTECH Wire

Italy . 172 parts In-Stock

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TANS Electronics

Latvia . 5,487 parts In-Stock

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Kulean Microsystems

USA . 5,306 parts In-Stock

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SupplyDigital Components

Austria . 4,427 parts In-Stock

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Vigor

Singapore . 4,320 parts In-Stock

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Problanco Electronics

Mexico . 4,068 parts In-Stock

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Corphita

USA . 2,335 parts In-Stock

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UHIMA Technologies

Türkiye . 820 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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Microchip USA

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Overview

Unleash the power of precision and reliability with the SA575DR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality analog computational solutions that meet the demands of various applications. Whether you're looking to enhance audio processing or improve signal conditioning, this product offers unmatched value, benefits, and advantages for customers seeking optimal performance. Elevate your projects with the SA575DR2 and experience the difference that Onsemi's expertise can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

No. of Functions: 2

Having multiple functions in one component can save space and cost in a circuit design.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage level makes integration with other components easier.

Minimum Operating Temperature: -40 °C

The product can operate in harsh environments with low temperatures.

Maximum Operating Temperature: 85 °C

With a high temperature limit, the product can withstand elevated temperatures.

Nominal Bandwidth: 0.02 kHz

The product has a decent bandwidth for signal processing applications.

Technical Specifications

Analog Computational SA575DR2 attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

Nominal Bandwidth:

.02 kHz

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Maximum Positive Input Voltage:

7 V

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

5.5 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

SA575DR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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