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MVF60NN152CMK50

NXP Semiconductors

MVF60NN152CMK50 by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; No. of DMA Channels: 32;

Median Price

$47.005

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,600 parts In-Stock

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$47.005

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3,600

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$47.005

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Distributors (In-Stock)

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TME

Poland . 9,090 parts In-Stock

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100+ parts

$41.681

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Vyrian

USA . 5,350 parts In-Stock

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5,350

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Digiode

USA . 4,148 parts In-Stock

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Anansix

USA . 1,134 parts In-Stock

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Flip Electronics

USA . 85 parts In-Stock

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85

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Distributors (Availability)

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AZTECH Wire

Italy . 921 parts In-Stock

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$21.080

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921

$21.080

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QUARKTWIN TECHNOLOGY LTD

USA . 25,993 parts In-Stock

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25,993

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UNI Independent Distributors

Spain . 3,214 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,913 parts In-Stock

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Microchip USA

USA . 1,590 parts In-Stock

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Technical Specifications

Microprocessors MVF60NN152CMK50 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B364

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of Serial I/Os:

7

No. of Terminals:

364

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA364,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

1572864

Maximum Seated Height:

1.5 mm

Speed:

500 rpm

Maximum Supply Current:

850 mA

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MVF60NN152CMK50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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