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BGU7258X

NXP Semiconductors

BGU7258X by NXP Semiconductors

The NXP Semiconductors BGU7258X is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits at 3.3V supply voltage. The surface-mount device has a square shape, nickel palladium gold finish, and very thin profile for compact applications.

Median Price

$0.274

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

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$0.225

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3

$0.225

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Rochester

USA . 28,000 parts In-Stock

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$0.262

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$0.246

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$0.223

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28,000

$0.262

$0.246

$0.223

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DigiKey

USA . 2 parts In-Stock

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$0.560

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2

$0.560

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Mouser Electronics

USA . 613 parts In-Stock

1+ parts

$0.880

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$0.462

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$0.393

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$0.258

613

$0.880

$0.462

$0.393

$0.258

Chip1Stop

Japan . 82 parts In-Stock

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$0.287

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Verical

USA . 62 parts In-Stock

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$0.209

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Distributors (In-Stock)

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Digiode

USA . 2,291 parts In-Stock

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$0.249

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IBS Electronics

USA . 32,220 parts In-Stock

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$0.296

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DigiKey Marketplace

USA . 28,000 parts In-Stock

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Flip Electronics

USA . 7,465 parts In-Stock

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Chip Stock

USA . 5,500 parts In-Stock

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K-1 Technologies

USA . 5,188 parts In-Stock

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Vyrian

USA . 4,519 parts In-Stock

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Anansix

USA . 1,717 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,039 parts In-Stock

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$0.236

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$0.236

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Native Components

USA . 49 parts In-Stock

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$0.299

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$0.287

49

$0.299

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$0.287

Northwest PG Solutions

USA . 1,570 parts In-Stock

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$0.328

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$0.290

1,570

$0.328

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$0.290

Authorized Procurement Solutions

USA . 87,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

India . 29,279 parts In-Stock

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Lixinc

USA . 17,780 parts In-Stock

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UNI Independent Distributors

Spain . 8,137 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 3,679 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,038 parts In-Stock

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Overview

Elevate your cellphone's performance with the BGU7258X by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors guarantees top-notch quality and reliability. The BGU7258X falls under the category of Cellphone ICs, making it an essential component for enhancing communication capabilities in mobile devices. With its cutting-edge design and advanced features, this product offers unparalleled value to customers by improving signal strength, minimizing interference, and optimizing overall performance. Upgrade your cellphone experience today with the BGU7258X.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices such as cellphones.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto the PCB, saving time and cost in manufacturing.

No. of Terminals: 6

Having 6 terminals provides sufficient connectivity options for integrating the IC into various cellphone circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand demanding usage conditions without overheating or performance degradation.

Nominal Supply Voltage: 3.3 V

Operating at a standard supply voltage of 3.3V, the IC is compatible with common power sources in cellphone devices.

Technical Specifications

Cellphone ICs BGU7258X attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.06,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

BGU7258X Telecommunications trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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