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BF992R-TAPE-7

NXP Semiconductors

BF992R-TAPE-7 by NXP Semiconductors

BF992R-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a dual gate, depletion mode operation with a max DS breakdown voltage of 20V and operates in the very high frequency band. This surface-mount transistor ensures efficient performance with a compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 2,429 parts In-Stock

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Digiode

USA . 1,212 parts In-Stock

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Vyrian

USA . 34 parts In-Stock

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One Stop Electronics

USA . 1,168 parts In-Stock

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$19.050

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UNI Independent Distributors

Spain . 1,382 parts In-Stock

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Corphita

USA . 1,220 parts In-Stock

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Native Components

USA . 937 parts In-Stock

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Northwest PG Solutions

USA . 138 parts In-Stock

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Overview

Elevate your designs with the BF992R-TAPE-7 from NXP Semiconductors, a leader renowned for innovation and reliability. This high-performance RF FET excels in amplifier applications, delivering superior signal quality in compact, space-saving packages. Experience unmatched efficiency and thermal stability, ensuring your projects run smoothly even under demanding conditions. Choose BF992R-TAPE-7 to unlock new possibilities and drive your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers good durability and protection, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance than P-channel types, resulting in lower on-resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration enables improved handling of feedback and protection against reverse polarity, enhancing reliability.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for audio and RF applications, providing high gain and low distortion.

Surface Mount: YES

Surface-mount technology allows for compact designs and automated assembly, making it cost-effective and space-efficient.

Minimum DS Breakdown Voltage: 20 V

This breakdown voltage provides sufficient protection against over-voltage conditions, ensuring reliable operation in various applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB space and allows for efficient layout and heat dissipation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide robust mechanical support on the PCB.

Operating Mode: DUAL GATE, DEPLETION MODE

Dual gate improves control over the switching characteristics, making it suitable for high-frequency applications.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Operating in the very high frequency band makes this FET suitable for RF and microwave applications.

No. of Terminals: 4

Four terminals provide flexibility in circuit design, enabling various connection configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package supports compact designs, making it ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for higher efficiency and better thermal performance compared to traditional bipolar junction transistors.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliable performance in harsh conditions, extending the application range.

Transistor Element Material: SILICON

Silicon provides high performance, reliability, and thermal stability, making it a standard choice for FET applications.

Maximum Drain Current (ID): 0.04 A

A maximum drain current of 0.04 A is suitable for low-power applications, making it efficient for signal amplification.

Terminal Position: DUAL

Dual terminal positions create versatile connectivity options for various circuit designs and enhance usability.

Case Connection: SOURCE

Case connection to the source maximizes performance and minimizes parasitic effects in circuit applications.

Maximum Feedback Capacitance (Crss): 0.04 pF

Low feedback capacitance minimizes signal distortion, making this FET a good choice for high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF992R-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.04 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF992R-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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