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BF904WR-TAPE-7

NXP Semiconductors

BF904WR-TAPE-7 by NXP Semiconductors

BF904WR-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 7V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device ensures efficient performance with a max temp of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,720 parts In-Stock

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2,720

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Digiode

USA . 741 parts In-Stock

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741

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Vyrian

USA . 137 parts In-Stock

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137

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Distributors (Availability)

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Native Components

USA . 463 parts In-Stock

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$0.204

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$0.196

463

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$0.196

Northwest PG Solutions

USA . 900 parts In-Stock

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$0.224

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$0.198

900

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$0.198

One Stop Electronics

USA . 962 parts In-Stock

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$6.050

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962

$6.050

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UNI Independent Distributors

Spain . 3,880 parts In-Stock

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Corphita

USA . 3,100 parts In-Stock

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Overview

Elevate your RF designs with the BF904WR-TAPE-7 from NXP Semiconductors, a trusted leader in high-quality semiconductor solutions. This versatile N-channel FET offers exceptional performance in ultra-high frequency applications, making it perfect for amplifiers in communication systems. With its durable plastic/epoxy packaging and built-in diode, you benefit from reliability and efficiency, ensuring optimal signal integrity and reduced noise. Experience enhanced design flexibility and superior functionality with NXP's commitment to innovation and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and provides effective insulation, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and superior performance in amplification applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode offers enhanced protection and simplifies circuit design.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is ideal for various audio and RF applications.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and better electrical performance.

Minimum DS Breakdown Voltage: 7 V

A minimum breakdown voltage of 7V ensures reliability in high-voltage applications and protects against unexpected surges.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs and allows for efficient packing in electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering options, ensuring a robust attachment to the PCB.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

Dual gate operation enhances control over the transistor, improving overall amplifier performance and linearity.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET suitable for modern RF communication applications.

No. of Terminals: 4

With 4 terminals, this FET supports versatile configurations and simplifies connection to PCB.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space, making the FET ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high switching speeds and efficiency, making this transistor capable of handling dynamic signals.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C provides robustness for high-temperature environments.

Transistor Element Material: SILICON

Silicon material contributes to stability and high performance, ensuring reliable operation in various applications.

Maximum Drain Current (ID): 0.03 A

A drain current of 30mA is suitable for a range of low-power applications without overheating.

Terminal Position: DUAL

Dual terminal position enhances flexibility in layout design and reduces parasitic capacitance.

Case Connection: SOURCE

Having the source as the case connection improves thermal dissipation, enhancing device longevity.

Maximum Feedback Capacitance (Crss): 0.035 pF

A low feedback capacitance indicates excellent frequency response, allowing for high-speed applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF904WR-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.035 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF904WR-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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