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BF824,235

NXP Semiconductors

BF824,235 by NXP Semiconductors

The NXP Semiconductors BF824,235 is a PNP RF BJT with 30V VCEO and 450MHz fT. With Gull Wing terminals and small outline package, it's ideal for high-frequency applications requiring low power dissipation up to 0.3W. The transistor's silicon element ensures reliable performance in surface-mount designs at temperatures up to 150°C.

Median Price

$0.425

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,725 parts In-Stock

1+ parts

$0.350

100+ parts

$0.136

1k+ parts

$0.090

10k+ parts

$0.063

14,725

$0.350

$0.136

$0.090

$0.063

Mouser Electronics

USA . 18,956 parts In-Stock

1+ parts

$0.500

100+ parts

$0.216

1k+ parts

$0.119

10k+ parts

$0.080

18,956

$0.500

$0.216

$0.119

$0.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 157 parts In-Stock

1+ parts

$0.238

100+ parts

-

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157

$0.238

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Chip Stock

USA . 54,000 parts In-Stock

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54,000

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Vyrian

USA . 6,295 parts In-Stock

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6,295

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Anansix

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

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Corphita

USA . 2,522 parts In-Stock

1+ parts

$0.225

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2,522

$0.225

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Native Components

USA . 1,126 parts In-Stock

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$0.303

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$0.291

1,126

$0.303

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$0.291

Northwest PG Solutions

USA . 1,098 parts In-Stock

1+ parts

$0.333

100+ parts

-

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$0.294

1,098

$0.333

-

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$0.294

AZTECH Wire

Italy . 3,584 parts In-Stock

1+ parts

$0.350

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3,584

$0.350

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Microchip USA

USA . 4,177 parts In-Stock

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$0.394

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4,177

$0.394

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Component Stockers USA

USA . 16,730 parts In-Stock

1+ parts

$0.400

100+ parts

$0.110

1k+ parts

$0.070

10k+ parts

$0.050

16,730

$0.400

$0.110

$0.070

$0.050

QUARKTWIN TECHNOLOGY LTD

USA . 6,039 parts In-Stock

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6,039

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Supply Digital

USA . 2,426 parts In-Stock

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2,426

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UNI Independent Distributors

Spain . 432 parts In-Stock

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432

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Overview

Unlock the power of cutting-edge technology with the BF824,235 from NXP Semiconductors. This RF Small Signal Bipolar Junction Transistor offers unparalleled quality and performance, making it the ideal choice for a wide range of applications. With its PNP polarity, small outline package style, and maximum operating temperature of 150°C, this transistor delivers exceptional value and benefits to customers. Trust NXP Semiconductors to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers good protection for the transistor and ensures durability.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into PNP circuit designs, making it versatile for various applications.

Surface Mount: YES

Being surface mountable, this transistor can be easily mounted onto circuit boards, saving space and aiding in efficient PCB layout.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3W, this transistor can handle moderate power levels, making it suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures the transistor can operate reliably in various environmental conditions.

Maximum Collector-Emitter Voltage: 30 V

The high maximum collector-emitter voltage rating of 30V allows for use in a variety of voltage applications.

Nominal Transition Frequency (fT): 450 MHz

With a high nominal transition frequency of 450MHz, this transistor offers excellent high-frequency performance, suitable for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BF824,235 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.3 pF

Maximum Collector-Emitter Voltage:

30 V

Configuration:

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF824,235 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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