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BF1206F,115

NXP Semiconductors

BF1206F,115 by NXP Semiconductors

BF1206F,115 by NXP Semiconductors is an N-channel FET designed for dual gate enhancement mode applications. It supports a max drain current of 30 mA and power dissipation of 180 mW, operating up to 150 °C. Ideal for surface mount configurations in various electronic circuits.

Median Price

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3

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1k+

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Digiode

USA . 3,335 parts In-Stock

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Anansix

USA . 2,761 parts In-Stock

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Vyrian

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Native Components

USA . 779 parts In-Stock

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$0.378

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Northwest PG Solutions

USA . 1,419 parts In-Stock

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$0.433

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One Stop Electronics

USA . 1,466 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock the potential of your next project with the BF1206F,115 from NXP Semiconductors—a trusted name in innovation. This N-channel Power FET delivers reliability and efficiency for a range of applications, from RF amplifiers to signal processing. With superior thermal performance and a compact design, it ensures seamless operation even under demanding conditions. Choose NXP for quality that enhances performance and drives success in your designs!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility and can provide better performance in switching applications, making this product a robust choice for various electronic designs.

Configuration: SINGLE

The single configuration ensures simplicity in circuit design and makes the device suitable for a wide range of applications where minimal complexity is preferred.

Surface Mount: YES

Surface mount technology allows for reduced circuit board space requirements and enables automated assembly processes, enhancing manufacturing efficiency.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate enhancement mode provides improved control features and allows for better performance in analog switching applications, making it versatile for various uses.

Maximum Drain Current (Abs) (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET can handle moderate power levels suitable for low-power applications, ensuring reliability in diverse conditions.

Maximum Power Dissipation (Abs): 0.18 W

A maximum power dissipation of 0.18 W indicates the device's ability to operate efficiently while managing heat generation, contributing to its longevity and performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology offers lower gate power consumption and improved switching capabilities, making it an excellent choice for modern electronic devices.

Maximum Operating Temperature: 150 °C

The ability to operate at temperatures up to 150 °C ensures the transistor can function effectively in high-temperature environments, enhancing its durability and application range.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides good solderability and resistance to corrosion, ensuring reliable connections and longevity in assemblies.

Maximum Drain Current (ID): 0.03 A

This specification confirms the FET's capability to handle a maximum current of 0.03 A, providing consistent performance in low-current applications.

Technical Specifications

Power Field Effect Transistors (FET) BF1206F,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Trade Compliance

BF1206F,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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