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BF1202,215

NXP Semiconductors

BF1202,215 by NXP Semiconductors

BF1202,215 by NXP Semiconductors is an N-channel FET designed for efficient power management. It supports a max drain current of 30 mA and power dissipation of 200 mW, operating up to 150 °C. Ideal for compact surface mount applications in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,947 parts In-Stock

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Digiode

USA . 4,413 parts In-Stock

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Anansix

USA . 1,585 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Native Components

USA . 796 parts In-Stock

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$0.147

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$0.141

796

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Northwest PG Solutions

USA . 852 parts In-Stock

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$0.161

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$0.142

852

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One Stop Electronics

USA . 1,360 parts In-Stock

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$2.050

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$2.050

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AZTECH Wire

Italy . 88 parts In-Stock

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$12.430

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Component Stockers USA

USA . 312 parts In-Stock

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$99.990

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Perfect Parts

USA . 6,832 parts In-Stock

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UNI Independent Distributors

Spain . 6,539 parts In-Stock

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Corphita

USA . 3,538 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Glotronic Ltd.

UK . 80 parts In-Stock

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Overview

Elevate your designs with the BF1202,215 from NXP Semiconductors—a trusted leader in innovative electronics. This N-channel power FET stands out for its reliability and superior performance, ensuring efficient operation across various applications. With surface mount capabilities and robust thermal management, it delivers unmatched value, enabling your projects to thrive while minimizing energy consumption. Experience quality craftsmanship that empowers your next breakthrough!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high electron mobility, providing better performance and efficiency in switching applications.

Configuration: SINGLE

Single configuration offers simplicity and ease of integration into circuits, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount design ensures compact layouts and high density in printed circuit boards (PCBs), enhancing space efficiency.

Maximum Drain Current (Abs) (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET is ideal for low-power applications, ensuring energy efficiency and reduced heat generation.

Maximum Power Dissipation (Abs): 0.2 W

A power dissipation rating of 0.2 W allows the component to operate effectively in applications with limited power budgets, contributing to overall system reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making it suitable for battery-operated and low-power devices.

Maximum Operating Temperature: 150 °C

The elevated maximum operating temperature enables this FET to function reliably in harsh environments, ensuring stability and long-term performance.

Terminal Finish: Tin (Sn)

Tin plating offers excellent solderability and corrosion resistance, ensuring durable connections and longevity of the device in applications.

Maximum Drain Current (ID): 0.03 A

Reiterating the maximum drain current of 0.03 A, this FET strikes a balance for low energy consumption while delivering necessary performance.

Technical Specifications

Power Field Effect Transistors (FET) BF1202,215 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Trade Compliance

BF1202,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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