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BB179,315

NXP Semiconductors

BB179,315 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 35 V; Nominal Diode Capacitance: 18.22 pF; Terminal Finish: TIN; JESD-609 Code: e3;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,649 parts In-Stock

1+ parts

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2,649

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Digiode

USA . 2,631 parts In-Stock

1+ parts

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2,631

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Vyrian

USA . 2,581 parts In-Stock

1+ parts

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2,581

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,458 parts In-Stock

1+ parts

$0.010

100+ parts

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1,458

$0.010

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Native Components

USA . 800 parts In-Stock

1+ parts

$0.424

100+ parts

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10k+ parts

$0.407

800

$0.424

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$0.407

Northwest PG Solutions

USA . 419 parts In-Stock

1+ parts

$0.467

100+ parts

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$0.411

419

$0.467

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$0.411

AZTECH Wire

Italy . 1,147 parts In-Stock

1+ parts

$20.270

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1,147

$20.270

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UNI Independent Distributors

Spain . 6,753 parts In-Stock

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6,753

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Corphita

USA . 3,035 parts In-Stock

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3,035

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Technical Specifications

Varactor Diodes BB179,315 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Nominal Diode Capacitance:

18.22 pF

JESD-609 Code:

e3

Maximum Repetitive Peak Reverse Voltage:

35 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

BB179,315 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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