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74ALS175D-T

NXP Semiconductors

74ALS175D-T by NXP Semiconductors

74ALS175D-T by NXP Semiconductors is a 4-bit latch with a propagation delay of 16 ns, operating at a nominal voltage of 5V. It features complementary output and supports positive edge triggering. Ideal for digital circuits requiring reliable data storage and transfer.

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3

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1k+

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Digiode

USA . 4,667 parts In-Stock

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Anansix

USA . 1,993 parts In-Stock

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Vyrian

USA . 395 parts In-Stock

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395

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One Stop Electronics

USA . 1,620 parts In-Stock

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$39.000

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Native Components

USA . 374 parts In-Stock

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$220.397

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$215.989

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$213.785

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$211.581

374

$220.397

$215.989

$213.785

$211.581

Northwest PG Solutions

USA . 634 parts In-Stock

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$242.437

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Corphita

USA . 4,694 parts In-Stock

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UNI Independent Distributors

Spain . 3,811 parts In-Stock

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Overview

Unlock seamless performance and reliability with the 74ALS175D-T from NXP Semiconductors. Designed for high-quality latching applications, this compact, state-of-the-art flip-flop solution ensures efficient data handling in a variety of electronic devices. With NXP's renowned commitment to innovation and excellence, you gain unmatched durability and precision, empowering your designs with speed and efficiency. Elevate your projects with this versatile component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and enables automated assembly processes.

Package Shape: RECTANGULAR

A rectangular package shape offers compatibility with standard PCB layouts, making integration straightforward.

No. of Bits: 4

Having 4 bits allows for handling of a wider range of digital signals, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V aligns well with industry standards, offering compatibility with numerous devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF supports reliable signal integrity, ensuring stable operation in fast environments.

No. of Terminals: 16

With 16 terminals, the product provides multiple connection options, enhancing its functionality and adaptability.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact placement on PCB, which is ideal for space-constrained designs.

Propagation Delay (tpd): 16 ns

A propagation delay of 16 ns ensures fast switching speeds, which is essential for high-speed applications.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C makes this product reliable for use in moderately high-temperature environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger allows for precise timing operations, making it suitable for synchronous circuits.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal positions facilitate easier soldering and improved connectivity to the board.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm is beneficial for low-profile applications, improving overall design aesthetics.

Width: 3.9 mm

A compact width of 3.9 mm makes it feasible in dense layouts, optimizing overall board space.

Output Polarity: COMPLEMENTARY

Complementary output polarity enhances flexibility in driving various types of loads.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V provides flexibility for power supply design, accommodating various applications.

Length: 9.9 mm

A length of 9.9 mm helps in compact PCB designs, contributing to overall space efficiency.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, this product is perfect for everyday consumer electronics and devices.

Technology: TTL

Using TTL technology ensures compatibility and reliability, making it a trusted choice in digital applications.

Terminal Form: GULL WING

Gull wing terminals are easy to solder, improving manufacturing efficiency and assembly quality.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and ease of soldering, making it practical for many PCB designs.

Minimum fmax: 60 MHz

A minimum frequency of 60 MHz supports high-speed signal processing, suitable for advanced digital applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides headroom for power supply variations, ensuring stable performance.

Maximum Power Supply Current (ICC): 14 mA

With a maximum current of 14 mA, this product is energy efficient, contributing to lower power consumption in designs.

Technical Specifications

Latches & Flip-Flops 74ALS175D-T attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

60 MHz

Trade Compliance

74ALS175D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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