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74ALS273DB

NXP Semiconductors

74ALS273DB by NXP Semiconductors

74ALS273DB by NXP is an 8-bit positive edge-triggered latch with a propagation delay of just 11 ns. It operates at a nominal voltage of 5V and supports temperatures from 0 °C to 70 °C. Ideal for high-speed digital applications, it features a compact SOIC package.

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 1,807 parts In-Stock

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Digiode

USA . 450 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 238 parts In-Stock

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UNI Independent Distributors

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Corphita

USA . 4,698 parts In-Stock

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Northwest PG Solutions

USA . 732 parts In-Stock

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Native Components

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Overview

Elevate your designs with the 74ALS273DB from NXP Semiconductors, a powerhouse in latches and flip-flops. Renowned for their precision and reliability, NXP ensures that you get quality components that stand the test of time. This versatile device, ideal for high-speed data handling, offers seamless integration in various applications—from consumer electronics to industrial systems—enhancing performance while simplifying your design process. Choose NXP for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers robust protection and stability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and facilitates automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout flexibility and integration into circuit designs.

No. of Bits: 8

An 8-bit architecture provides sufficient complexity for a wide array of digital circuit applications.

Nominal Supply Voltage / Vsup: 5V

Standard 5V operation ensures compatibility with most existing digital systems and ease of integration.

Load Capacitance (CL): 50 pF

Optimized load capacitance allows for enhanced signal integrity and reduced noise issues in high-speed applications.

No. of Terminals: 20

A higher number of terminals supports more flexible connectivity and integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline package with shrink pitch minimizes PCB area usage while maximizing performance.

Propagation Delay (tpd): 11 ns

A low propagation delay enables high-speed operation, making the product suitable for fast digital circuits.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in a variety of thermal environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for predictable timing behavior and synchronization with standard clock signals.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C guarantees performance in cooler environments, expanding application possibilities.

Terminal Position: DUAL

Dual terminal positioning improves accessibility during assembly and testing, simplifying production processes.

Maximum Seated Height: 2 mm

A low seated height profile is beneficial for compact designs where space is at a premium.

Width: 5.3 mm

The narrow width supports dense circuit layouts and helps maintain PCB space efficiency.

Output Polarity: TRUE

True output polarity simplifies interfacing with other logic components in digital designs.

Minimum Supply Voltage (Vsup): 4.5V

A minimum supply voltage of 4.5V provides flexibility in supply options within typical digital systems.

Length: 7.2 mm

The compact length allows integration into tight configurations while maintaining performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures versatility for general consumer and industrial applications.

Technology: TTL

Using TTL technology ensures compatibility and reliability across various digital applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and alignment during automated assembly processes.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch provides a balance of space efficiency and ease of soldering.

Minimum fmax: 65 MHz

Supports a minimum frequency of 65 MHz, making it suitable for high-speed applications.

Maximum Supply Voltage (Vsup): 5.5V

Allows for operation within a safe voltage range, enhancing the reliability of the device.

Maximum Power Supply Current (ICC): 29 mA

A maximum ICC of 29 mA ensures reasonable power consumption while supporting high functionality.

Technical Specifications

Latches & Flip-Flops 74ALS273DB attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

65 MHz

Trade Compliance

74ALS273DB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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