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74ALS174D-T

NXP Semiconductors

74ALS174D-T by NXP Semiconductors

74ALS174D-T by NXP Semiconductors is a 6-bit TTL latch with a 15 ns propagation delay, operating at a nominal voltage of 5V. It features surface mount technology in a compact rectangular package. Ideal for digital circuits requiring reliable data storage and transfer.

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3

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1k+

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Digiode

USA . 3,953 parts In-Stock

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Vyrian

USA . 3,731 parts In-Stock

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Anansix

USA . 1,040 parts In-Stock

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Native Components

USA . 671 parts In-Stock

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Northwest PG Solutions

USA . 1,789 parts In-Stock

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One Stop Electronics

USA . 409 parts In-Stock

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UNI Independent Distributors

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Corphita

USA . 4,185 parts In-Stock

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Overview

Unlock superior performance with the 74ALS174D-T by NXP Semiconductors—your go-to solution for reliable latches and flip-flops. Crafted with precision, this device ensures seamless data handling across a variety of applications, from consumer electronics to industrial automation. With NXP’s renowned commitment to quality and innovation, you benefit from enhanced efficiency and durability, empowering your designs to thrive in demanding environments. Experience unmatched reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight yet durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, making assembly easier and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on PCBs and facilitates easy handling during assembly.

No. of Bits: 6

With 6 bits, this product provides ample data processing capability for a range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V makes it compatible with most logic circuits and systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates good performance in high-frequency applications, reducing signal degradation.

No. of Terminals: 16

Having 16 terminals provides flexibility for connections and enhances the functionality of the device.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in saving space on the board, ideal for compact electronic designs.

Propagation Delay (tpd): 15 ns

A propagation delay of 15 ns allows for relatively fast switching, making this device suitable for speed-sensitive applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product is reliable in various environments, including warmer conditions.

Trigger Type: POSITIVE EDGE

The positive edge triggering design ensures reliable operation in synchronous circuits, enhancing overall performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for use in a range of environments, from indoor to cooler outdoor applications.

Terminal Position: DUAL

Dual terminal position facilitates easier PCB layout options and improves device integration.

Maximum Seated Height: 1.75 mm

A low seated height means the product is suitable for applications requiring minimal profile components.

Width: 3.9 mm

A narrow width enables space-efficient designs while ensuring compatibility with standard PCB layouts.

Output Polarity: TRUE

Using true output polarity ensures that the device operates with expected logic levels, simplifying integration.

Minimum Supply Voltage (Vsup): 4.5 V

Operating with a minimum supply voltage of 4.5V gives designers flexibility in system power management.

Length: 9.9 mm

A compact length supports designs where space is at a premium, facilitating easy placement on crowded PCBs.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this product is suitable for everyday consumer applications.

Technology: TTL

Using TTL technology ensures high speed and low power consumption, making it ideal for modern digital circuits.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and improves the reliability of connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard in many designs, optimizing compatibility with various PCB layouts.

Minimum fmax: 60 MHz

A minimum fmax of 60 MHz indicates suitability for high-speed applications, making it a robust choice for fast circuits.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for slight variations in power supply, enhancing operational reliability.

Maximum Power Supply Current (ICC): 14 mA

With a maximum current of 14 mA, this product is efficient in power usage, making it suitable for battery-operated devices.

Technical Specifications

Latches & Flip-Flops 74ALS174D-T attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

60 MHz

Trade Compliance

74ALS174D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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