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74ALS273N

NXP Semiconductors

74ALS273N by NXP Semiconductors

74ALS273N by NXP is an 8-bit latch with a TTL technology, operating at a nominal voltage of 5V and featuring a propagation delay of just 11 ns. It supports positive edge triggering and has a max temp of 70 °C. Ideal for digital circuits requiring fast data storage.

Median Price

$2.000

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Overview

Elevate your designs with the 74ALS273N from NXP Semiconductors—where quality meets reliability. This versatile 8-bit latch is engineered for exceptional performance, making it ideal for a myriad of applications, from communication systems to data processing. With NXP’s renowned commitment to innovation and durability, you can trust that this product will enhance your projects, streamline operations, and deliver peace of mind in any environment. Choose 74ALS273N for unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package ensures durability and protection against environmental factors, making it a reliable choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, enabling easier integration into circuit designs.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data manipulation tasks, making it suitable for various digital applications.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V is standard in many digital circuits, ensuring compatibility with a wide range of existing designs.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps to maintain signal integrity and enhances performance in high-speed applications.

No. of Terminals: 20

Having 20 terminals provides flexibility in circuit design, allowing for multiple connections and functionalities.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier installation and alignment on the PCB, streamlining the assembly process.

Propagation Delay (tpd): 11 ns

A propagation delay of 11 ns ensures fast switching times, which is crucial for high-performance applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a variety of environmental conditions.

Trigger Type: POSITIVE EDGE

The positive edge trigger type allows for synchronized data capture, increasing the reliability of data processing.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product is suitable for a wide range of temperature-sensitive applications.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility, aiding in various PCB routing configurations.

Maximum Seated Height: 4.2 mm

A seated height of 4.2 mm enables compact designs while maintaining compatibility with standard mounting equipment.

Width: 7.62 mm

The 7.62 mm width helps to save space on PCBs, allowing for more compact designs without compromising performance.

Output Polarity: TRUE

True output polarity simplifies design in many applications, ensuring straightforward interfacing with other logic circuits.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in a range of low-power applications.

Length: 26.73 mm

The length of 26.73 mm provides adequate spacing for terminals while maintaining a compact footprint.

Temperature Grade: COMMERCIAL

Being commercially graded makes this product suitable for general use, balancing performance and cost efficiency.

Technology: TTL

Using TTL technology ensures fast switching speeds and robustness, making it suitable for high-speed digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and is easier to hand-solder compared to surface mount alternatives.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard in many applications, ensuring compatibility with existing PCB designs.

Minimum fmax: 65 MHz

A minimum frequency capability of 65 MHz allows for high-speed data processing, making this product suitable for advanced electronics.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides headroom for voltage fluctuations, enhancing reliability.

Maximum Power Supply Current (ICC): 29 mA

With a maximum power supply current of 29 mA, this product offers efficient power consumption suitable for low-power designs.

Technical Specifications

Latches & Flip-Flops 74ALS273N attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

65 MHz

Trade Compliance

74ALS273N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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