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74ALS112AD-T

NXP Semiconductors

74ALS112AD-T by NXP Semiconductors

74ALS112AD-T by NXP Semiconductors is a TTL dual negative edge-triggered latch with a 5V nominal supply. It features a fast propagation delay of 10.5 ns and operates within -0 °C to 70 °C, making it ideal for commercial applications in compact electronics. With a load capacitance of 50 pF, it's perfect for efficient data storage and processing.

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1k+

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Digiode

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Anansix

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Native Components

USA . 48 parts In-Stock

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Northwest PG Solutions

USA . 1,901 parts In-Stock

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One Stop Electronics

USA . 797 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock limitless potential with the 74ALS112AD-T from NXP Semiconductors! This high-quality latch and flip-flop module offers unparalleled reliability and performance, making it ideal for diverse applications like data storage and signal processing. With its compact design and efficient power usage, this component ensures seamless integration into your projects, providing exceptional value and benefits that enhance your designs. Elevate your innovation with NXP's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides adequate protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for easier integration into compact and modern electronic designs.

No. of Functions: 2

With two functions available, it offers versatility for various applications, making it suitable for multi-functional designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, allowing for denser configurations.

No. of Bits: 2

Having two bits improves data handling capabilities, enabling more complex logic operations.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal voltage of 5V is compatible with a wide range of existing electronic systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is favorable for fast switching applications, ensuring stable performance.

No. of Terminals: 16

With 16 terminals, it provides ample connectivity options, facilitating various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving solutions without compromising performance.

Propagation Delay (tpd): 10.5 ns

A propagation delay of 10.5 ns ensures quick response times, ideal for high-speed applications.

Maximum Operating Temperature: 70 °C

Rated for a maximum temperature of 70 °C, making it suitable for reliable operation in moderately high-temperature environments.

Trigger Type: NEGATIVE EDGE

Negative edge triggering is advantageous for synchronizing with other digital circuits, improving timing accuracy.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for functional deployment in cooler environments.

Terminal Position: DUAL

Dual terminal position facilitates easier mounting options and enhances circuit board layout flexibility.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm supports low-profile designs, keeping components close to the PCB.

Width: 3.9 mm

A narrow width of 3.9 mm allows for compact designs where space is at a premium.

Output Polarity: COMPLEMENTARY

Complementary output polarity enhances circuit design flexibility, particularly in driving signals.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, it can be used in a variety of power systems.

Length: 9.9 mm

At 9.9 mm in length, it supports compact arrangements while preserving functionality.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures reliability for everyday applications within specified temperature ranges.

Technology: TTL

Using TTL technology guarantees fast switching speeds and reliability in digital circuits.

Terminal Form: GULL WING

Gull wing terminals provide robust electrical connections and simplify soldering on PCBs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard in many electronic designs, facilitating easy integration into existing layouts.

Minimum fmax: 35 MHz

With a minimum frequency of 35 MHz, it is suitable for high-speed digital applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures the device remains functional under varying power supply conditions.

Maximum Power Supply Current (ICC): 4.5 mA

A low maximum power supply current of 4.5 mA contributes to energy efficiency, important for battery-operated devices.

Technical Specifications

Latches & Flip-Flops 74ALS112AD-T attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

4.5 mA

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Minimum fmax:

35 MHz

Trade Compliance

74ALS112AD-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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