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74ALVC16373DT

Onsemi

74ALVC16373DT by Onsemi

74ALVC16373DT by Onsemi is a CMOS latch with 8 bits and 3.6 ns propagation delay at 3.3V, suitable for industrial applications. It features a small outline package with dual gull wing terminals and operates b/w -40 to 85 °C, making it ideal for high-speed data transfer in harsh environments.

Median Price

$0.562

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

$0.542

1k+ parts

$0.450

10k+ parts

$0.401

2,496

-

$0.542

$0.450

$0.401

DigiKey

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.680

10k+ parts

-

2,496

-

-

$0.680

-

Verical

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.562

10k+ parts

$0.501

2,496

-

-

$0.562

$0.501

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,917 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

-

10k+ parts

-

1,917

$0.365

-

-

-

Digiode

USA . 1,401 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

-

10k+ parts

-

1,401

$0.422

-

-

-

DigiKey Marketplace

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

$0.460

1k+ parts

-

10k+ parts

-

2,496

-

$0.460

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 321 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$0.365

-

-

-

Corphita

USA . 604 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$0.400

-

-

-

Kulean Microsystems

USA . 6,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,125

-

-

-

-

SupplyDigital Components

Austria . 5,414 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,414

-

-

-

-

TANS Electronics

Latvia . 3,392 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,392

-

-

-

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Problanco Electronics

Mexico . 3,140 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,140

-

-

-

-

Continental Prestige Electronics

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

$0.365

1k+ parts

-

10k+ parts

-

2,496

-

$0.365

-

-

Northwest PG Solutions

USA . 871 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.384

10k+ parts

-

871

-

-

$3.384

-

Native Components

USA . 685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.350

10k+ parts

-

685

-

-

$3.350

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UHIMA Technologies

Türkiye . 48 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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48

-

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Overview

Discover the high-performance 74ALVC16373DT latch flip-flop by Onsemi, a premium quality product designed for industrial applications. With a fast propagation delay of only 3.6 ns and 3-STATE output characteristics, this innovative solution offers exceptional speed and efficiency. Featuring a small outline and thin profile package style, this versatile component is perfect for compact designs. Trust in Onsemi's reputation for superior manufacturing and invest in the reliability and precision of the 74ALVC16373DT for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to heat, making this product suitable for industrial applications.

Propagation Delay At Nominal Supply: 3.6 ns

With a low propagation delay of 3.6 ns at nominal supply voltage, this latch & flip-flop offers fast operation, ideal for time-sensitive applications.

Surface Mount: YES

The surface mount feature makes it easy to integrate this latch & flip-flop onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having 2 functions in one component provides added functionality and versatility in designing electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and utilization of space on the circuit board.

No. of Bits: 8

With 8 bits, this latch & flip-flop can handle a larger amount of data, making it suitable for applications requiring higher computational capabilities.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this product energy-efficient and compatible with many standard power sources.

Load Capacitance (CL): 30 pF

The 30 pF load capacitance ensures stable performance and reliable operation of the latch & flip-flop in various circuit configurations.

Power Supplies (V): 3.3

Matching the power supply voltage of 3.3V simplifies integration with other components in the system, reducing the need for additional components for voltage regulation.

No. of Terminals: 48

The 48 terminals provide ample connections for interfacing with other circuit components, offering flexibility in circuit design and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim profile of this package style saves space on the circuit board and allows for dense packing of components, ideal for applications with size constraints.

Maximum I (ol): 24 Amp

With a high maximum output current of 24 Amps, this latch & flip-flop can drive larger loads, making it suitable for applications that require high current handling capability.

Maximum Operating Temperature: 85 °C

Operating reliably up to 85 °C ensures performance in demanding industrial environments with elevated temperatures.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, allowing for tri-state outputs that can be used for bus sharing and multiplexing applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures reliable operation even in harsh cold environments, making this latch & flip-flop suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and corrosion resistance, enhancing the reliability and longevity of the latch & flip-flop in various operating conditions.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and easy PCB layout, providing flexibility in circuit design and board assembly.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures the stability and integrity of solder joints during the assembly process, making this latch & flip-flop suitable for lead-free soldering techniques.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range operation, this latch & flip-flop can withstand harsh environmental conditions and maintain reliable performance in demanding industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast operation, making this latch & flip-flop suitable for a wide range of digital applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring reliable electrical connections and robust performance of the latch & flip-flop.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on the PCB, enabling compact and efficient circuit board design in space-constrained applications.

Technical Specifications

Latches & Flip-Flops 74ALVC16373DT attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.6 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

74ALVC16373DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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