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ZL30255LFF7

Microchip Technology

ZL30255LFF7 by Microchip Technology

Microchip Technology ZL30255LFF7 is a 64-terminal CMOS clock generator with a supply voltage range of 1.71V to 1.89V, operating b/w -40°C to 85°C. This chip carrier has a very thin profile and is suitable for applications requiring precise timing control in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,429 parts In-Stock

1+ parts

$15.000

100+ parts

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1k+ parts

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10k+ parts

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1,429

$15.000

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Corohmni

South Africa . 248 parts In-Stock

1+ parts

$72.901

100+ parts

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248

$72.901

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QualityLine Systems

Poland . 8,378 parts In-Stock

1+ parts

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8,378

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XL Components Corporation

Australia . 7,976 parts In-Stock

1+ parts

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7,976

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Marpe Global Electronics

Taiwan . 6,814 parts In-Stock

1+ parts

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6,814

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Elevate your electronic designs with the ZL30255LFF7 by Microchip Technology. With a reputation for quality and innovation, Microchip Technology delivers cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This surface-mount chip carrier boasts a very thin profile, making it ideal for a wide range of applications. From clock generation to other peripheral functions, this CMOS technology device offers customers exceptional value, precision, and reliability. Take your projects to the next level with the ZL30255LFF7 from Microchip Technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, making this product suitable for compact electronic devices.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage provides flexibility in power input options for the product.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts and facilitates efficient space utilization in electronic designs.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and functionality in the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slub, and very thin profile package style enables effective heat dissipation and compact design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy-efficient operation and compatibility with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range indicates robust performance and reliability in varied environmental conditions.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range ensures the product's functionality in extreme temperature environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy placement and soldering during the assembly process, enhancing manufacturing efficiency.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim profile of the product, making it suitable for thin electronic devices.

Width: 5 mm

Compact width dimension enables space-saving design integration in electronic applications with limited board space.

Length: 10 mm

The moderate length dimension offers a balance between compactness and functionality in the product design.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The inclusion of clock generator and other peripheral IC types enhances the product's versatility and compatibility with various system configurations.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable performance in electronic circuits.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process and reduces the risk of solder joint fatigue, enhancing the product's durability.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a standard operating voltage level for the product, ensuring consistent performance across different applications.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density packaging of components on the PCB, enabling compact and efficient electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ZL30255LFF7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XQCC-N64

Length:

10 mm

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

ZL30255LFF7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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