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ZL30250LDF1

Microchip Technology

ZL30250LDF1 by Microchip Technology

ZL30250LDF1 by Microchip: 32-terminal IC with CMOS tech, 1.71-1.89V supply, -40 to 85°C temp range. Ideal for industrial microprocessor circuits in surface-mount applications.

Median Price

$12.586

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$12.586

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54

$12.586

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Vyrian

USA . 342 parts In-Stock

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342

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,518 parts In-Stock

1+ parts

$12.586

100+ parts

-

1k+ parts

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10k+ parts

$12.334

1,518

$12.586

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$12.334

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$12.586

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1,000

$12.586

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$15.414

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664

$15.414

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Ampacity Inc.

Singapore . 1,125 parts In-Stock

1+ parts

$34.000

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1,125

$34.000

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Aztec Data Supply Inc.

USA . 4,013 parts In-Stock

1+ parts

$53.710

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4,013

$53.710

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Corohmni

South Africa . 64 parts In-Stock

1+ parts

$70.126

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64

$70.126

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QUARKTWIN TECHNOLOGY LTD

USA . 14,892 parts In-Stock

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14,892

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Fulton Briggs Corp.

USA . 7,705 parts In-Stock

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7,705

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Argo Parts USA

USA . 4,600 parts In-Stock

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4,600

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Overview

Discover the cutting-edge ZL30250LDF1 by Microchip Technology, a top-tier manufacturer known for its superior quality and innovative technology. This product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering unmatched reliability and performance. With a sleek square package shape and quad terminal position, this microprocessor circuit boasts a nominal supply voltage of 1.8V and a wide temperature range, making it ideal for industrial applications. Experience seamless integration and optimal functionality with the ZL30250LDF1, a game-changer in the world of peripheral ICs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and ensuring a secure connection.

Maximum Supply Voltage: 1.89 V

A higher maximum supply voltage provides flexibility in power input options and compatibility with a variety of systems.

Package Shape: SQUARE

The square package shape is commonly used and can ensure a compact design, improving overall aesthetics and functionality.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options and supports complex circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides enhanced thermal management and space-saving benefits.

Minimum Supply Voltage: 1.71 V

A lower minimum supply voltage ensures efficient power consumption and can support operation in a wider range of voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stability in demanding applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in diverse environments, including industrial settings or outdoor applications.

Terminal Position: QUAD

The quad terminal position allows for secure and reliable connections, minimizing the risk of signal interference or disconnection.

Maximum Seated Height: 1 mm

A low maximum seated height facilitates installation in compact spaces and contributes to a streamlined design.

Width: 5 mm

The 5mm width provides a balance between space-saving design and adequate surface area for connectivity and heat dissipation.

Length: 5 mm

With a length of 5mm, this product offers a square form factor that can optimize PCB layout and component placement.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets stringent temperature requirements and can withstand rugged operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product offers advanced computing capabilities and can support complex functions in electronic devices.

Technology: CMOS

CMOS technology ensures low power consumption, high-speed performance, and compatibility with a wide range of systems and devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes, reduces soldering requirements, and enhances reliability in interconnection.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V offers a standard operating level that is commonly supported by various power sources and components.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product enables high-density mounting and fine-pitch connections for increased design flexibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ZL30250LDF1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

ZL30250LDF1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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