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ZL30251LDG1

Microchip Technology

ZL30251LDG1 by Microchip Technology

ZL30251LDG1 by Microchip Technology is a CMOS MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE package style. It operates b/w -40 to 85 °C and has a supply voltage range of 1.71V to 1.89V, making it ideal for INDUSTRIAL applications requiring low power consumption and compact design.

Median Price

$12.130

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 490 parts In-Stock

1+ parts

$12.130

100+ parts

$9.787

1k+ parts

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10k+ parts

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490

$12.130

$9.787

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Distributors (In-Stock)

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Vyrian

USA . 7,158 parts In-Stock

1+ parts

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7,158

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Bristol Electronics

USA . 675 parts In-Stock

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675

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Nova Conductors

Japan . 96 parts In-Stock

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96

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14 parts In-Stock

1+ parts

$8.690

100+ parts

-

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14

$8.690

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Component Stockers USA

USA . 1,024 parts In-Stock

1+ parts

$11.760

100+ parts

$8.920

1k+ parts

$8.230

10k+ parts

-

1,024

$11.760

$8.920

$8.230

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Corohmni

South Africa . 2,179 parts In-Stock

1+ parts

$38.415

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2,179

$38.415

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QUARKTWIN TECHNOLOGY LTD

USA . 7,707 parts In-Stock

1+ parts

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7,707

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A-Z Elektronik GmbH

Germany . 6,657 parts In-Stock

1+ parts

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6,657

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RGB Technical Solutions

Ukraine . 6,563 parts In-Stock

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6,563

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Metaverse IC Inc.

Canada . 632 parts In-Stock

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632

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Kepictronics

USA . 378 parts In-Stock

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378

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ChipstoGo Electronic ltd

UK . 32 parts In-Stock

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32

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Overview

Unlock the power of advanced technology with the ZL30251LDG1 by Microchip Technology. Designed to meet the highest quality standards, this product offers unparalleled performance and reliability in a compact square package. Perfect for a wide range of applications, this peripheral IC provides customers with exceptional value, benefits, and advantages that will elevate their projects to the next level. Trust in Microchip Technology to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 1.89 V

Offers a high maximum supply voltage, providing flexibility in power supply options for various applications.

Package Shape: SQUARE

Square package shape enables efficient use of board space and facilitates uniform thermal dissipation.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting with other components in the circuit, allowing for versatile integration.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles cater to different requirements and application scenarios, enhancing adaptability and performance.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated environmental conditions and function reliably in demanding situations.

Minimum Operating Temperature: -40 °C

Can operate effectively in low-temperature environments, expanding the range of applications and environments where the product can be used.

Terminal Position: QUAD

Quad terminal position simplifies the connection process and provides a secure and stable interface with other components.

Maximum Seated Height: 1 mm

Low seated height allows for compact and space-saving designs, ideal for applications with limited space availability.

Width: 5 mm

Narrow width dimension contributes to the product's overall compactness, enabling integration into small form factor devices.

Length: 5 mm

Short length dimension further enhances the product's compactness and suitability for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments, making the product suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of a microprocessor circuit expands the product's capabilities and functionality, enhancing its suitability for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and efficient operation, making the product reliable and energy-efficient.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process and enhances reliability in the connection, ensuring stable performance over time.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage facilitates consistent and reliable operation, ensuring optimal performance in various operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling compact designs and efficient use of board space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ZL30251LDG1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

ZL30251LDG1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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