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AGLN060V5-VQG100

Microchip Technology

AGLN060V5-VQG100 by Microchip Technology

Microchip Technology's AGLN060V5-VQG100 is a CMOS FPGA with 1536 CLBs and 60000 gates. It operates at 1.5V, has a max supply voltage of 1.575V, and can function in temperatures ranging from -20 to 70°C. Ideal for applications requiring high gate count and programmable logic capabilities.

Median Price

$11.564

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

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$11.564

100+ parts

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$11.448

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4

$11.564

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$11.448

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Verical

USA . 4 parts In-Stock

1+ parts

$11.564

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$11.448

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4

$11.564

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$11.448

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Microchip Technology

USA . 111 parts In-Stock

1+ parts

$19.140

100+ parts

$14.620

1k+ parts

$7.050

10k+ parts

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111

$19.140

$14.620

$7.050

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 89 parts In-Stock

1+ parts

$11.820

100+ parts

$10.720

1k+ parts

$9.800

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89

$11.820

$10.720

$9.800

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Vyrian

USA . 7,650 parts In-Stock

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7,650

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VNN

France . 1,557 parts In-Stock

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1,557

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Chip Stock

USA . 377 parts In-Stock

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377

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Digiode

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297

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Nova Conductors

Japan . 29 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 609 parts In-Stock

1+ parts

$30.000

100+ parts

$29.250

1k+ parts

$29.100

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609

$30.000

$29.250

$29.100

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RGB Technical Solutions

Ukraine . 3,490 parts In-Stock

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3,490

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 1,803 parts In-Stock

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1,803

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Perfect Parts

USA . 1,403 parts In-Stock

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1,403

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Netroflash

USA . 100 parts In-Stock

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100

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Corphita

USA . 72 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the AGLN060V5-VQG100 by Microchip Technology. As a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA), Microchip delivers cutting-edge technology that meets the highest industry standards. Perfect for a wide range of applications, this FPGA offers exceptional value and benefits to customers looking for high-quality, versatile solutions. Trust Microchip Technology to provide you with the competitive advantage you need to succeed in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and resistance to harsh environmental conditions, making the FPGA reliable for various applications.

Surface Mount: YES

Surface mount capability simplifies the assembly process and allows for easy integration into PCB designs.

Maximum Supply Voltage: 1.575 V

Operating at a maximum supply voltage of 1.575 V helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of CLBs: 1536

Having 1536 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex digital circuits and logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB and facilitates easier routing of signal traces.

No. of Equivalent Gates: 60000

With 60,000 equivalent gates, the FPGA offers a high level of logic capacity for implementing complex designs and algorithms.

Nominal Supply Voltage (V): 1.5

Operating at a nominal supply voltage of 1.5 V strikes a balance between performance and power consumption, making it suitable for a wide range of applications.

No. of Terminals: 100

Having 100 terminals provides flexibility in connecting external components and peripherals to the FPGA, enabling versatile system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reconfigurability, rapid prototyping, and flexibility in implementing custom logic functions.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers space-saving benefits, ease of PCB layout, and compatibility with modern assembly techniques.

Minimum Supply Voltage: 1.425 V

Operating at a minimum supply voltage of 1.425 V ensures stable performance at lower power levels, extending battery life in portable devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the FPGA can withstand moderate thermal environments without compromising performance.

Pitch Of Terminal: 0.5 mm

The 0.5 mm pitch of terminals allows for high-density PCB designs and facilitates easy soldering during assembly.

Organization: 1536 CLBS, 60000 GATES

The organization of 1536 Configurable Logic Blocks (CLBs) and 60,000 gates provides a structured framework for implementing digital circuits with scalability and efficiency.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20°C, the FPGA can operate in cold environments or industrial settings without performance degradation.

Finishing Of Terminal Used: TIN

Tin finishing of terminals ensures reliable electrical connections and corrosion resistance, enhancing the overall durability of the FPGA.

Position Of Terminal: QUAD

Quad position of terminals simplifies PCB assembly and allows for efficient routing of signals, reducing interference and signal loss.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures that the FPGA can withstand moderate exposure to moisture during assembly and operation.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, the FPGA can fit into compact designs and reduce the overall profile of the PCB.

Width: 14 mm

The 14 mm width of the FPGA provides a compact form factor for space-constrained applications while maintaining sufficient room for routing signals.

Length: 14 mm

The 14 mm length of the FPGA offers a balanced footprint on the PCB, allowing for efficient placement and alignment with other components.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN060V5-VQG100 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

1536

No. of Equivalent Gates:

60000

Technology:

CMOS

Organization:

1536 CLBS, 60000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.2 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

AGLN060V5-VQG100 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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