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EP2SGX90FF1508C5N

Intel

EP2SGX90FF1508C5N by Intel

EP2SGX90FF1508C5N by Intel is a FPGA with 90960 logic cells and 650 inputs/outputs. Operating at a max clock frequency of 640 MHz, it is ideal for applications requiring high-speed processing such as telecommunications, signal processing, and data encryption. With a package style of grid array and dimensions of 40mm x 40mm, this device offers versatile programmability for various design needs.

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Nova Conductors

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Andel Nordic

Denmark . 4,278 parts In-Stock

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AZTECH Wire

Italy . 538 parts In-Stock

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Semicontronic

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$11.640

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Ampacity Inc.

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One Stop Electronics

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Modulus Dynamics

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MARBEL Systems

Belgium . 2,584 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Perfect Parts

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Qasali Group International

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Supply Digital

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Bastille Electronics

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Overview

Unleash the power of cutting-edge technology with the EP2SGX90FF1508C5N by Intel. As a leading manufacturer in Field Programmable Gate Arrays (FPGA), Intel delivers top-quality products that offer unparalleled performance and versatility. This FPGA boasts 90960 logic cells, 1508 terminals, and a maximum clock frequency of 640 MHz, making it perfect for a wide range of applications. Whether you're looking to enhance your industrial automation system or develop advanced signal processing solutions, the EP2SGX90FF1508C5N provides incredible value, benefits, and advantages to meet your unique needs. Upgrade your projects today with Intel's exceptional FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, perfect for various applications.

No. of Logic Cells: 90960

With a high number of logic cells, this FPGA offers ample resources for complex designs and high-performance applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto printed circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA more energy-efficient.

No. of CLBs: 90960

The large number of Configurable Logic Blocks (CLBs) offers flexibility and scalability for designing custom logic circuits.

Technology Used: CMOS

Utilizing CMOS technology ensures high speed, low power consumption, and reliability in operation.

No. of Inputs: 650

With a generous number of input pins, this FPGA can accommodate a wide range of external signals and data inputs.

Package Shape: SQUARE

The square package shape simplifies PCB layout and component placement, optimizing space utilization in designs.

Form Of Terminal: BALL

The ball form of terminal ensures secure and reliable connections, reducing the risk of signal interference or disconnection.

Nominal Supply Voltage (V): 1.2

The consistent nominal supply voltage of 1.2V provides stability and reliability in operation.

Power Supplies (V): 1.2, 1.2/3.3, 3.3

Multiple power supply options cater to different voltage requirements, enhancing versatility in various applications.

No. of Terminals: 1508

The abundant number of terminals allows for enhanced connectivity and functionality in complex designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility for customization and adaptability to evolving project requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a stable and reliable mounting solution, ideal for industrial and high-reliability applications.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage enables efficient power management and operation at lower voltage levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and performance in harsh environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals aids in high-density integration and compact PCB designs.

Maximum Combinatorial Delay of a CLB: 5.962 ns

With low combinatorial delays, this FPGA can achieve high-speed performance and efficient signal processing.

Organization: 90960 CLBS

The organized structure of 90960 CLBs facilitates logical partitioning and easy management of complex designs.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature enables reliable operation even in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing enhances the terminal's conductivity and durability, ensuring reliable connections.

Position Of Terminal: BOTTOM

The bottom positioning of terminals simplifies PCB routing and layout, optimizing signal integrity and board space.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, this FPGA can withstand moderate humidity levels during storage and assembly processes.

Maximum Seated Height: 3.5 mm

The low seated height allows for compact and slim designs, suitable for space-constrained applications.

Width: 40 mm

The compact width of 40mm makes this FPGA suitable for designs where space is limited.

Maximum Clock Frequency: 640 MHz

With a high maximum clock frequency, this FPGA can handle demanding real-time processing tasks efficiently.

No. of Outputs: 650

The ample number of output pins enables the FPGA to drive multiple external devices and interfaces, enhancing connectivity and functionality.

Length: 40 mm

The moderate length of 40mm provides a balanced form factor for easy integration into various electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2SGX90FF1508C5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

90960

No. of Inputs:

650

No. of Outputs:

650

No. of CLBs:

90960

Maximum Clock Frequency:

640 MHz

CLB Maximum Delay:

5.962 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

90960 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1508,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1508

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2SGX90FF1508C5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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