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EP2SGX60CF780C5N

Intel

EP2SGX60CF780C5N by Intel

EP2SGX60CF780C5N by Intel is a FPGA with 60440 logic cells and 364 inputs/outputs. Operating at 640 MHz, it uses CMOS technology and has a max combinatorial delay of 5.962 ns. Ideal for applications requiring high-speed processing and programmable logic capabilities in fields like telecommunications and industrial automation.

Median Price

$492.205

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Arrow

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Verical

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Rochester

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DigiKey

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Digiode

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DigiKey Marketplace

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Nova Conductors

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Vyrian

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Touchstone Systems

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Rebound Electronics

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Advanced Electronics

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Kenton Components

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Modulus Dynamics

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Corohmni

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Semicontronic

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Ampacity Inc.

Singapore . 155 parts In-Stock

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One Stop Electronics

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Corphita

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Qasali Group International

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Vigor

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Aranea Global

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Microchip USA

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Argo Parts USA

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Authorized Procurement Solutions

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Glotronic Ltd.

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Supply Digital

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S.R.D Solutions

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Perfect Parts

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GreenTree Electronics

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Overview

Unleash the power of innovation with the EP2SGX60CF780C5N by Intel, a cutting-edge Field Programmable Gate Array (FPGA) that offers unmatched quality and performance. With 60440 logic cells and a maximum clock frequency of 640 MHz, this FPGA is designed to revolutionize a wide range of applications. From aerospace to telecommunications, this versatile device provides the flexibility and speed needed to bring ideas to life. Trust Intel's renowned expertise in semiconductor technology to deliver a product that exceeds expectations. Elevate your projects with the EP2SGX60CF780C5N and experience the value of true innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, making it suitable for a variety of applications.

No. of Logic Cells: 60440

Having a large number of logic cells allows for complex logic designs to be implemented efficiently in the FPGA.

Surface Mount: YES

Being surface mountable makes the FPGA easy to integrate into electronic circuits and PCB designs.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25V ensures safe operation and power efficiency of the FPGA.

Technology Used: CMOS

The use of CMOS technology in the FPGA offers low power consumption and high noise immunity, making it an efficient choice for various applications.

No. of Inputs: 364

Having a high number of inputs allows for more versatility in designing the functionality of the FPGA.

Package Shape: SQUARE

The square package shape offers efficient use of space and ease of placement on a PCB.

Form Of Terminal: BALL

The ball terminal form provides easy soldering and connection to the PCB, ensuring reliable operation of the FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable operation and compatibility with common power supply standards.

Power Supplies (V): 1.2,1.2/3.3,3.3

Having multiple power supply options allows for flexibility in design and compatibility with different system configurations.

No. of Terminals: 780

Having a high number of terminals provides ample connectivity options and flexibility in integrating the FPGA into a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for customization and reconfiguration of the logic functions, making it suitable for prototyping and flexible design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient thermal performance and mechanical stability, ensuring reliable operation of the FPGA.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15V ensures compatibility with low-power operation requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for operation in a wide range of environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch allows for compact and efficient layout on the PCB, saving space and facilitating assembly.

Maximum Combinatorial Delay of a CLB: 5.962 ns

The low combinatorial delay of the CLBs ensures fast and efficient processing of logic functions in the FPGA.

Organization: 60440 CLBS

The organization of 60440 CLBs allows for scalable and complex logic designs to be implemented in the FPGA.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation in a wide range of environmental conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals provides good conductivity and corrosion resistance, ensuring long-term reliability of the FPGA.

Position Of Terminal: BOTTOM

Having the terminals positioned at the bottom allows for easy soldering and connection to the PCB, ensuring reliable operation of the FPGA.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the level of protection against moisture damage, making the FPGA suitable for a variety of environments.

Maximum Seated Height: 3.5 mm

The low maximum seated height of 3.5mm allows for compact and space-efficient PCB designs when integrating the FPGA.

Width: 29 mm

The 29mm width provides a compact form factor for the FPGA, allowing for efficient use of space on the PCB.

Maximum Clock Frequency: 640 MHz

The high maximum clock frequency of 640MHz allows for fast processing of logic functions and high-speed operation of the FPGA.

No. of Outputs: 364

Having a high number of outputs provides ample signaling options and flexibility in connecting the FPGA to other components in a circuit.

Length: 29 mm

The 29mm length provides a compact form factor for the FPGA, allowing for efficient use of space on the PCB.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2SGX60CF780C5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

60440

No. of Inputs:

364

No. of Outputs:

364

No. of CLBs:

60440

Maximum Clock Frequency:

640 MHz

CLB Maximum Delay:

5.962 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

60440 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2SGX60CF780C5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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