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EP2S90H484C5

Intel

EP2S90H484C5 by Intel

EP2S90H484C5 by Intel is a Field Programmable Gate Array (FPGA) with 90960 logic cells and 36384 configurable logic blocks (CLBs). It operates at a max supply voltage of 1.25V and is commonly used in applications requiring high-performance programmable ICs.

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Overview

Discover the EP2S90H484C5 by Intel, a cutting-edge Field Programmable Gate Array (FPGA) that will revolutionize your projects. With its advanced CMOS technology and impressive 90960 logic cells, this FPGA offers unparalleled performance and versatility. Whether you're designing complex circuits or implementing intricate algorithms, the EP2S90H484C5 delivers outstanding results. Its compact square package and surface mount capability make it easy to integrate into any application. Experience the power of Intel's exceptional manufacturing quality and unlock limitless possibilities with the EP2S90H484C5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the FPGA, making it suitable for various applications.

No. of Logic Cells: 90960

With a large number of logic cells, this FPGA offers ample resources for complex designs, allowing for the implementation of sophisticated functionalities.

Surface Mount: YES

Being surface mountable, this FPGA offers ease of installation and integration into electronic systems, ensuring efficient PCB designs and saving valuable space.

Maximum Supply Voltage: 1.25 V

The high maximum supply voltage allows for flexibility in power supply options, enabling the FPGA to adapt to different voltage requirements in various applications.

No. of CLBs: 36384

With a generous number of configurable logic blocks (CLBs), this FPGA can accommodate a wide range of digital circuits and enable the implementation of diverse functionalities.

Technology Used: CMOS

Employing complementary metal-oxide-semiconductor (CMOS) technology ensures low power consumption, high noise immunity, and compatibility with other integrated circuits, making this FPGA an energy-efficient choice.

No. of Inputs: 308

The abundant number of inputs allows for extensive connectivity options, enabling the FPGA to interface with various peripherals and systems, enhancing its versatility.

Package Shape: SQUARE

The square package shape offers ease of handling, compatibility with standard PCB layouts, and efficient use of space, making it suitable for compact electronic devices.

Form Of Terminal: BALL

Featuring ball terminals, this FPGA simplifies the assembly process, ensuring reliable connections and facilitating rework or replacement, enhancing the overall manufacturability of the product.

Nominal Supply Voltage (V): 1.2

The specified nominal supply voltage provides a stable power source for the FPGA, ensuring consistent and reliable performance throughout its operational lifespan.

Power Supplies (V): 1.2,1.5/3.3,3.3

Supporting multiple power supply voltages allows for compatibility with a wide range of systems and ensures flexibility in meeting varied design requirements.

No. of Terminals: 484

With a significant number of terminals, this FPGA offers ample interfaces for I/O connectivity, enabling seamless integration with other components and systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array, this product provides immense flexibility, allowing users to reconfigure the FPGA for different applications, saving time and cost compared to custom ASICs.

Package Style (Meter): GRID ARRAY

The grid array package style ensures a high-density footprint, enabling efficient use of PCB area, improving routing capabilities, and enabling compact system designs.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage provides compatibility with low-voltage systems and enables power-saving operation, making it suitable for battery-powered devices or energy-conscious applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions, ensuring robust performance in industrial or high-temperature applications.

Pitch Of Terminal: 1 mm

The small pitch of the terminals facilitates high-density packaging, allowing for increased integration and connectivity, making it an ideal choice for applications with limited space.

Organization: 36384 CLBS

The organized architecture of 36384 configurable logic blocks (CLBs) enables efficient logic design and implementation, facilitating rapid prototyping and reducing development time.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making this FPGA suitable for diverse applications in different climates.

Finishing Of Terminal Used: TIN LEAD

The use of tin-lead as the terminal finishing material ensures excellent solderability, corrosion resistance, and long-term reliability, ensuring robust connections and longevity of the FPGA.

Position Of Terminal: BOTTOM

Featuring bottom-positioned terminals, this FPGA simplifies PCB layout and assembly, optimizing signal routing and facilitating effective heat dissipation, improving system performance.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this FPGA can withstand moderate moisture exposure during handling and storage, ensuring long-term reliability and minimizing the risk of moisture-related failures.

Maximum Seated Height: 3.5 mm

The low maximum seated height allows for compact PCB designs and compatibility with space-constrained applications, ensuring efficient utilization of available enclosure space.

Width: 27 mm

The specified width ensures compatibility with standardized packaging and facilitates seamless integration into electronic systems, ensuring convenience and ease during product development.

No. of Outputs: 300

With a generous number of outputs, this FPGA allows for versatile signal routing, supporting various output configurations and enhancing the flexibility and functionality of the design.

Length: 27 mm

The specified length ensures compatibility with standardized packaging and facilitates seamless integration into electronic systems, providing convenience and ease during product development.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2S90H484C5 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

90960

No. of Inputs:

308

No. of Outputs:

300

No. of CLBs:

36384

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

36384 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.5/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP2S90H484C5 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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