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EP2SGX30CF780C5N

Intel

EP2SGX30CF780C5N by Intel

EP2SGX30CF780C5N by Intel is a FPGA with 33880 logic cells and CLBs, operating at max 640 MHz clock frequency. Suitable for applications requiring high-speed processing, it features CMOS technology, 361 inputs/outputs, and a compact square package with a grid array style.

Median Price

$1,938.360

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Arrow

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Verical

USA . 60 parts In-Stock

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Nova Conductors

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Digiode

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Vyrian

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Bristol Electronics

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AZTECH Wire

Italy . 584 parts In-Stock

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Modulus Dynamics

Lithuania . 118 parts In-Stock

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Continental Prestige Electronics

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$75.880

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Netroflash

USA . 100 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$86.699

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$78.896

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Corohmni

South Africa . 686 parts In-Stock

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Aztec Data Supply Inc.

USA . 330 parts In-Stock

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Texas Native Microelectronics

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Qasali Group International

UK . 468 parts In-Stock

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Corphita

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Component Stockers USA

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Vigor

Singapore . 510 parts In-Stock

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Ampacity Inc.

Singapore . 60 parts In-Stock

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Semicontronic

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One Stop Electronics

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Microchip USA

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Supply Digital

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S.R.D Solutions

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Kenton Components

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Overview

Unleash the power of cutting-edge technology with the EP2SGX30CF780C5N by Intel. Crafted by a renowned manufacturer, this Field Programmable Gate Array boasts exceptional quality and performance. With a wide range of applications in various industries, this FPGA offers unparalleled value and benefits to customers looking for versatility and reliability. Elevate your projects to new heights with the EP2SGX30CF780C5N and experience the advantage of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 33880

The high number of logic cells provides ample resources for complex programmable logic designs.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic assemblies.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage helps in minimizing power consumption and heat dissipation.

No. of CLBs: 33880

Having a 1:1 ratio of logic cells to configurable logic blocks (CLBs) makes for efficient use of resources.

Technology Used: CMOS

Utilizing CMOS technology enables low power consumption and high noise immunity.

No. of Inputs: 361

With a high number of inputs, the FPGA can accommodate a large number of external signals.

Package Shape: SQUARE

The square package shape makes for easy handling and assembly onto circuit boards.

Nominal Supply Voltage (V): 1.2

The closely matched nominal supply voltage helps ensure stable and reliable operation.

Power Supplies (V): 1.2, 1.2/3.3, 3.3

Support for multiple power supply options allows for flexibility in system design.

No. of Terminals: 780

The high number of terminals provides ample connectivity options for interfacing with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this IC allows for customizable logic functions, making it versatile for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style aids in optimizing space on circuit boards for efficient layout.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the FPGA can function reliably in demanding environments.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise placement and alignment during soldering.

Maximum Combinatorial Delay of a CLB: 5.962 ns

The low maximum combinatorial delay of a CLB enables high-speed processing of logic operations.

Organization: 33880 CLBS

The organized structure of 33880 CLBs allows for efficient implementation of complex logic circuits.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the FPGA can function reliably even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Having terminals at the bottom facilitates easy soldering and connection to other components.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the FPGA can withstand moderate exposure to moisture during handling and storage.

Maximum Seated Height: 3.5 mm

The low maximum seated height helps in minimizing the overall profile of the FPGA on a circuit board.

Width: 29 mm

With a width of 29 mm, the FPGA can fit into compact electronic devices without occupying too much space.

Maximum Clock Frequency: 640 MHz

The high maximum clock frequency allows for rapid execution of logic operations and real-time processing.

No. of Outputs: 361

With a high number of outputs, the FPGA can drive multiple external devices and signals effectively.

Length: 29 mm

With a length of 29 mm, the FPGA has a compact form factor suitable for small-scale electronic applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2SGX30CF780C5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

33880

No. of Inputs:

361

No. of Outputs:

361

No. of CLBs:

33880

Maximum Clock Frequency:

640 MHz

CLB Maximum Delay:

5.962 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

33880 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2SGX30CF780C5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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