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EP2S15F672C3N

Intel

EP2S15F672C3N by Intel

EP2S15F672C3N by Intel is a FPGA with 15600 logic cells, 6240 CLBs, and 366 inputs. It operates at a max clock frequency of 717 MHz and is suitable for applications requiring high-speed processing and programmable logic capabilities in various industries.

Median Price

$488.750

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Mouser Electronics

USA . 7 parts In-Stock

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$488.750

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$488.750

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$488.750

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Nova Conductors

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Digiode

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Vyrian

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Semtec, LLC

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AZTECH Wire

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$5.881

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Modulus Dynamics

Lithuania . 1,040 parts In-Stock

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Corohmni

South Africa . 457 parts In-Stock

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Andel Nordic

Denmark . 5,144 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Texas Native Microelectronics

USA . 970 parts In-Stock

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Kenton Components

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

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Continental Prestige Electronics

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Argo Parts USA

USA . 2,125 parts In-Stock

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$412.928

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$408.757

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$404.586

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Qasali Group International

UK . 10 parts In-Stock

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Corphita

USA . 741 parts In-Stock

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Vigor

Singapore . 387 parts In-Stock

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Microchip USA

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Lixinc

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MARBEL Systems

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Glotronic Ltd.

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Supply Digital

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Netroflash

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$396.244

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$387.902

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Overview

Unleash the power of innovation with the EP2S15F672C3N by Intel. As a top-tier manufacturer in the field programmable gate arrays (FPGA) category, Intel brings you unparalleled quality and reliability. With 15600 logic cells and 6240 CLBs, this FPGA offers endless possibilities for customization and optimization. Whether you're working on telecommunications, automotive, or industrial applications, the EP2S15F672C3N delivers exceptional performance and flexibility. Trust Intel to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the EP2S15F672C3N and experience the true value of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, suitable for various applications.

No. of Logic Cells: 15600

With a high number of logic cells, this FPGA offers ample space for complex designs and functionalities.

Surface Mount: YES

Being surface mountable, this FPGA is easy to integrate onto existing PCBs, saving space and assembly time.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 6240

The large number of Configurable Logic Blocks allows for versatile programming and customization options.

Technology Used: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, making it an efficient choice.

No. of Inputs: 366

With a high number of inputs, this FPGA can handle a large amount of data simultaneously, suitable for data-intensive applications.

Package Shape: SQUARE

The square package shape offers better space utilization and facilitates easier PCB layout design.

Form Of Terminal: BALL

The use of ball terminals enables efficient soldering and reliable connections, ensuring stable performance.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides a standard operating range, making it compatible with various power sources.

Power Supplies (V): 1.2,1.5/3.3,3.3

The multiple power supply options offer flexibility in voltage selection, making it adaptable to different system requirements.

No. of Terminals: 672

With a high number of terminals, this FPGA provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for reprogramming and reconfiguring the device as needed, making it versatile.

Package Style (Meter): GRID ARRAY

The grid array package style offers a standardized and organized layout, simplifying PCB assembly and maintenance.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures stable operation even in low-power scenarios, enhancing reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions, suitable for industrial use.

Pitch Of Terminal: 1.27 mm

The standard terminal pitch simplifies PCB design and assembly, ensuring compatibility with commonly used components.

Maximum Combinatorial Delay of a CLB: 4.45 ns

The low combinatorial delay ensures fast processing and response times, making it suitable for real-time applications.

Organization: 6240 CLBS

Organized into 6240 Configurable Logic Blocks, this FPGA offers structured and efficient logic implementation, enhancing performance.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can operate in cold environments reliably, suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures good conductivity, corrosion resistance, and reliability in connections.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easier PCB routing and reduces interference with other components, enhancing design flexibility.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA is resistant to humidity and moisture, suitable for outdoor or high-humidity environments.

Maximum Seated Height: 2.6 mm

The low maximum seated height allows for a compact design and integration, saving space in applications with size constraints.

Width: 35 mm

With a width of 35 mm, this FPGA can fit into compact spaces without sacrificing functionality, making it versatile for various applications.

Maximum Clock Frequency: 717 MHz

The high maximum clock frequency enables fast data processing and high-speed operation, suitable for demanding computational tasks.

No. of Outputs: 358

With a high number of outputs, this FPGA can drive multiple external devices and deliver complex computations, suitable for high-performance applications.

Length: 35 mm

The length of 35 mm offers a compact form factor, making this FPGA suitable for applications with space constraints.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2S15F672C3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

15600

No. of Inputs:

366

No. of Outputs:

358

No. of CLBs:

6240

Maximum Clock Frequency:

717 MHz

CLB Maximum Delay:

4.45 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

6240 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.5/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1.27 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2S15F672C3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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