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EP2S90F1020C5N

Intel

EP2S90F1020C5N by Intel

EP2S90F1020C5N by Intel is a FPGA with 90960 logic cells, 36384 CLBs, and 758 inputs. It operates at a max clock frequency of 640 MHz and has a combinatorial delay of 5.962 ns per CLB. This FPGA is suitable for applications requiring high-speed processing and complex logic functions in various industries.

Median Price

$289.340

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Arrow

USA . 1,391 parts In-Stock

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Verical

USA . 1,391 parts In-Stock

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$264.640

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Component Sense

UK . 9 parts In-Stock

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Digiode

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Nova Conductors

Japan . 67 parts In-Stock

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Chip Stock

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Vyrian

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Bristol Electronics

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Lantek

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Connect4Technologies Inc.

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Prism Electronics

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Modulus Dynamics

Lithuania . 719 parts In-Stock

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$8.251

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MARBEL Systems

Belgium . 3,645 parts In-Stock

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$48.497

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Kenton Components

USA . 6,764 parts In-Stock

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Corohmni

South Africa . 606 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Ampacity Inc.

Singapore . 973 parts In-Stock

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$175.670

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Semicontronic

India . 949 parts In-Stock

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One Stop Electronics

USA . 943 parts In-Stock

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Corphita

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Component Stockers USA

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

USA . 1,427 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Vigor

Singapore . 859 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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S.R.D Solutions

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Qasali Group International

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Supply Digital

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Perfect Parts

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Kepictronics

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Benley Electronics

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Overview

Unlock endless possibilities with the Intel EP2S90F1020C5N Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA boasts unparalleled quality and reliability. With over 90,000 logic cells and a maximum clock frequency of 640 MHz, this versatile device is perfect for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing data processing, the EP2S90F1020C5N offers unmatched value, flexibility, and performance to help you bring your ideas to life. Experience the Intel difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness to the product, making it a reliable choice for various applications.

No. of Logic Cells: 90960

With a high number of logic cells, this FPGA offers extensive processing power and flexibility for complex designs.

Surface Mount: YES

Being surface-mountable makes this FPGA easy to integrate into various electronic systems, saving time and effort in the assembly process.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage ensures energy efficiency and helps prevent potential damage to the device.

No. of CLBs: 36384

The large number of Configurable Logic Blocks (CLBs) allows for versatile customization, making it suitable for a wide range of applications.

Technology Used: CMOS

Utilizing CMOS technology provides high speed and low power consumption, enhancing the overall performance of the FPGA.

No. of Inputs: 758

The abundance of input options enables the FPGA to handle a large amount of data input, facilitating complex calculations and operations.

Package Shape: SQUARE

The square package shape offers a compact design, maximizing space efficiency in electronic layouts.

Form Of Terminal: BALL

The use of ball terminals ensures secure connections and reliable performance in challenging environments.

Nominal Supply Voltage (V): 1.2

The stable nominal supply voltage ensures consistent operation and reliability of the FPGA in various conditions.

Power Supplies (V): 1.2,1.5/3.3,3.3

The multiple power supply options offer flexibility and compatibility with diverse voltage requirements in different applications.

No. of Terminals: 1020

The abundance of terminals allows for enhanced connectivity options and versatility in system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array enables users to customize and reconfigure the device based on specific requirements, offering great flexibility.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure mounting and reliable connections, ensuring optimal performance and durability.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures efficient power usage and prevents overloading the device.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the FPGA to function reliably in various environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables high-density mounting and space-saving design in electronic systems.

Maximum Combinatorial Delay of a CLB: 5.962 ns

The low combinatorial delay ensures fast signal propagation and efficient processing within the CLBs.

Organization: 36384 CLBS

The organized structure of 36384 CLBs facilitates ease of design and implementation, enhancing the overall functionality of the FPGA.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures reliable performance even in harsh environmental conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper for terminal finishing provides excellent conductivity and resistance to corrosion, enhancing the longevity of the product.

Position Of Terminal: BOTTOM

The bottom terminal position allows for easy mounting and quick access during assembly and maintenance processes.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the FPGA has a moderate resistance to moisture, ensuring its reliability in various environments.

Maximum Seated Height: 3.5 mm

The low seated height makes the FPGA suitable for compact designs and space-constrained applications.

Width: 33 mm

The width of 33 mm offers a balance between compactness and accessibility, making the FPGA versatile for different system layouts.

Maximum Clock Frequency: 640 MHz

The high maximum clock frequency allows for fast data processing and efficient performance in demanding applications.

No. of Outputs: 750

The ample number of outputs provides flexibility in data transmission and processing, enhancing the versatility of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the FPGA can withstand thermal stress during assembly processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures effective soldering and reliable connections in different manufacturing environments.

Length: 33 mm

The length of 33 mm offers a balanced form factor for the FPGA, providing a good compromise between space efficiency and accessibility.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2S90F1020C5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

90960

No. of Inputs:

758

No. of Outputs:

750

No. of CLBs:

36384

Maximum Clock Frequency:

640 MHz

CLB Maximum Delay:

5.962 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

36384 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.5/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

33 mm

Width:

33 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1020,32X32,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1020

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2S90F1020C5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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