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EP2S90F1020C4N

Intel

EP2S90F1020C4N by Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;

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Sensible Micro Corp

USA . 1,542 parts In-Stock

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Digiode

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Vyrian

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Rebound Electronics

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Touchstone Systems

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Speed Components Ltd

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ComSIT Distribution GmbH

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ComSIT USA

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Native Components

USA . 848 parts In-Stock

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$1.680

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Northwest PG Solutions

USA . 11 parts In-Stock

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$1.848

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MARBEL Systems

Belgium . 5,658 parts In-Stock

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Texas Native Microelectronics

USA . 4,325 parts In-Stock

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Semicontronic

India . 1,046 parts In-Stock

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Kenton Components

USA . 1,406 parts In-Stock

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One Stop Electronics

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Qasali Group International

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Modulus Dynamics

Lithuania . 1,545 parts In-Stock

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Microchip USA

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Vigor

Singapore . 841 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Glotronic Ltd.

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Perfect Parts

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S.R.D Solutions

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Corphita

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Supply Digital

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A-Z Elektronik GmbH

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Kepictronics

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GreenTree Electronics

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Corohmni

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Futuretech Components

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2S90F1020C4N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

90960

No. of Inputs:

758

No. of Outputs:

750

No. of CLBs:

36384

Maximum Clock Frequency:

717 MHz

CLB Maximum Delay:

5.117 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

36384 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.5/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

33 mm

Width:

33 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1020,32X32,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1020

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2S90F1020C4N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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