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5CEFA5F23C8N

Intel

5CEFA5F23C8N by Intel

The Intel 5CEFA5F23C8N is a FPGA with 76500 logic cells, CMOS technology, and 240 inputs/outputs. It operates at a voltage range of 1.07V to 1.13V and has a max temperature of 85°C. This versatile chip is ideal for applications requiring high-speed data processing and complex logic functions in compact electronic systems.

Median Price

$165.100

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DigiKey

USA . 37 parts In-Stock

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Verical

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Digiode

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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Velocity Electronics

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VNN

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Chip Stock

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 664 parts In-Stock

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Modulus Dynamics

Lithuania . 141 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 67 parts In-Stock

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Ampacity Inc.

Singapore . 52 parts In-Stock

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Corphita

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Texas Native Microelectronics

USA . 4,944 parts In-Stock

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Corohmni

South Africa . 445 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Qasali Group International

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Vigor

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Lixinc

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Argo Parts USA

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Supply Digital

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Netroflash

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Kenton Components

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MARBEL Systems

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Perfect Parts

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Authorized Procurement Solutions

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Overview

Discover the limitless possibilities with the Intel 5CEFA5F23C8N Field Programmable Gate Array (FPGA). Crafted with precision by Intel, this FPGA offers unparalleled quality and reliability. With a staggering 76500 logic cells and 240 inputs and outputs, this FPGA is perfect for a wide range of applications. From aerospace to telecommunications, the Intel 5CEFA5F23C8N delivers exceptional performance and flexibility. Unlock your creativity and innovation with this cutting-edge technology that promises to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage.

No. of Logic Cells: 76500

A high number of logic cells allows for complex designs and versatile functionality in the FPGA.

Surface Mount: YES

Surface mount packaging makes the FPGA easy to integrate into electronic circuits and PCBs.

Maximum Supply Voltage: 1.13 V

A low maximum supply voltage helps in reducing power consumption and heat generation in the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.

No. of Inputs: 240

A high number of inputs allows for a greater number of connections and input signals in the FPGA design.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient form factor for the FPGA.

Form of Terminal: BALL

Ball terminals provide a reliable and secure connection for the FPGA, ensuring stable performance.

Nominal Supply Voltage (V): 1.1

A consistent nominal supply voltage helps in ensuring stable and reliable operation of the FPGA.

Power Supplies (V): 1.1,1.2/3.3,2.5

Multiple power supplies allow the FPGA to efficiently handle different voltage requirements for various components.

No. of Terminals: 484

A high number of terminals provide flexibility in connection options and signal routing for the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology offers reconfigurable hardware, allowing for flexibility and customization in electronics design.

Package Style (Meter): GRID ARRAY

A grid array package style offers easy assembly and reliable connections for the FPGA.

Minimum Supply Voltage: 1.07 V

A low minimum supply voltage ensures compatibility with a wide range of power sources for the FPGA.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature allows the FPGA to withstand harsh environmental conditions and operate in a variety of applications.

Pitch Of Terminal: 1 mm

A small pitch of terminals allows for a high density of connections in a compact space for the FPGA.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature ensures the FPGA can operate in cold environments without performance issues.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and integration of the FPGA into electronic systems.

Maximum Seated Height: 2 mm

A low seated height allows the FPGA to be compact and fit easily into tight spaces within electronic devices.

Width: 23 mm

A moderate width provides a balance between space efficiency and ease of handling for the FPGA.

No. of Outputs: 240

A high number of outputs allows for diverse signal routing and connectivity options in the FPGA design.

Length: 23 mm

A moderate length provides a balance between size and functionality, making the FPGA versatile and adaptable to different applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CEFA5F23C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

76500

No. of Inputs:

240

No. of Outputs:

240

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

5CEFA5F23C8N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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