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5CEFA9F27I7N

Intel

5CEFA9F27I7N by Intel

The Intel 5CEFA9F27I7N is a FPGA with 301,000 logic cells and CLBs. It operates at a max clock frequency of 622 MHz, making it suitable for high-performance applications in various industries such as telecommunications, aerospace, and automotive. With a package style of grid array and dimensions of 27mm x 27mm, this device offers advanced programmable IC technology for versatile design implementations.

Median Price

$540.530

Lifecycle Status

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Arrow

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DigiKey

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Verical

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Digiode

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Nova Conductors

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VNN

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Famous Connections Ltd

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Bristol Electronics

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Atlantic Semiconductor

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Touchstone Systems

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AZTECH Wire

Italy . 207 parts In-Stock

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MARBEL Systems

Belgium . 402 parts In-Stock

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Kenton Components

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Modulus Dynamics

Lithuania . 1,140 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

USA . 5,979 parts In-Stock

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Ampacity Inc.

Singapore . 19 parts In-Stock

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Semicontronic

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Corphita

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Corohmni

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Continental Prestige Electronics

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Argo Parts USA

USA . 568 parts In-Stock

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$529.853

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Microchip USA

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Lixinc

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Qasali Group International

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Authorized Procurement Solutions

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GreenTree Electronics

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Overview

Experience unparalleled performance and versatility with the 5CEFA9F27I7N by Intel, a top-tier Field Programmable Gate Array (FPGA). Boasting 301000 logic cells and utilizing cutting-edge CMOS technology, this FPGA offers limitless possibilities for customization and optimization. With a maximum clock frequency of 622 MHz and a wide range of power supplies, this device is perfect for high-performance applications in various industries. Trust Intel's reputation for excellence and innovation to deliver a superior product that exceeds expectations. Unlock the full potential of your projects with the 5CEFA9F27I7N FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable.

No. of Logic Cells: 301000

With a high number of logic cells, this FPGA can handle complex designs and calculations efficiently.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 1.13 V

The maximum supply voltage of 1.13V ensures safe and reliable operation of the FPGA.

No. of CLBs: 301000

The large number of CLBs provides ample resources for implementing various functions and features.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

No. of Inputs: 336

With a high number of inputs, this FPGA can interface with a wide range of external devices and sensors.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB.

Form Of Terminal: BALL

The use of ball terminals ensures secure connections and reliable signal transmission.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1V is a common standard, making it easy to integrate into existing systems.

Power Supplies (V): 1.1,1.2/3.3,2.5

The multiple power supply options provide flexibility in voltage requirements for different applications.

No. of Terminals: 672

The high number of terminals allows for versatile connectivity options with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility for customization and reconfiguration.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure attachment to the PCB for stable operation.

Minimum Supply Voltage: 1.07 V

The minimum supply voltage of 1.07V ensures compatibility with low-power systems.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for high-density packing on the PCB.

Organization: 301000 CLBS

The organization of 301000 CLBs offers abundant resources for complex logic implementations.

Finishing Of Terminal Used: TIN SILVER COPPER

The finishing of terminals with tin, silver, and copper enhances conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

The bottom position of terminals facilitates easy connection and routing on the PCB.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand moderate exposure to moisture during assembly.

Maximum Seated Height: 2 mm

The maximum seated height of 2mm allows for slim and compact designs.

Width: 27 mm

The 27mm width provides a balance between compact size and adequate spacing for connections.

Maximum Clock Frequency: 622 MHz

The high maximum clock frequency of 622MHz enables fast processing and data transmission.

No. of Outputs: 336

The high number of outputs allows for driving multiple devices and signals simultaneously.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30s, this FPGA can withstand high-temperature soldering processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable solder joints and component durability.

Length: 27 mm

The 27mm length offers a compact form factor for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CEFA9F27I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

301000

No. of Inputs:

336

No. of Outputs:

336

No. of CLBs:

301000

Maximum Clock Frequency:

622 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

301000 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CEFA9F27I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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