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5CEFA9F23C7N

Intel

5CEFA9F23C7N by Intel

The Intel 5CEFA9F23C7N is a FPGA with 301K logic cells, CMOS technology, and 230 inputs/outputs. It operates at 1.07-1.13V and supports multiple power supplies. This versatile chip is ideal for applications requiring high-speed data processing in compact electronic systems.

Median Price

$402.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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DigiKey

USA . 45 parts In-Stock

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$402.530

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Nova Conductors

Japan . 10 parts In-Stock

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$41.625

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Digiode

USA . 454 parts In-Stock

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$357.390

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VNN

France . 3,391 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 356 parts In-Stock

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$11.247

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Modulus Dynamics

Lithuania . 121 parts In-Stock

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$44.253

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$44.253

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Corohmni

South Africa . 232 parts In-Stock

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$107.627

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Texas Native Microelectronics

USA . 5,090 parts In-Stock

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$182.951

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$160.997

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Vigor

Singapore . 28 parts In-Stock

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$324.900

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Corphita

USA . 588 parts In-Stock

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Ampacity Inc.

Singapore . 45 parts In-Stock

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$342.150

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Semicontronic

India . 45 parts In-Stock

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$342.150

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$331.886

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One Stop Electronics

USA . 13 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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$405.544

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$389.322

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Continental Prestige Electronics

USA . 385 parts In-Stock

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$413.820

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Argo Parts USA

USA . 217 parts In-Stock

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$413.820

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$409.682

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$405.544

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$401.405

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Microchip USA

USA . 2,752 parts In-Stock

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$414.320

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Qasali Group International

UK . 403 parts In-Stock

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$459.390

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Supply Digital

USA . 1,478 parts In-Stock

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MARBEL Systems

Belgium . 1,053 parts In-Stock

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Kenton Components

USA . 90 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the 5CEFA9F23C7N by Intel. As a top manufacturer in the industry, Intel delivers unparalleled quality and reliability in the Field Programmable Gate Arrays category. With over 300,000 logic cells and 230 inputs and outputs, this FPGA offers endless possibilities for customization and innovation. Whether you're looking to optimize performance in industrial automation or enhance signal processing in telecommunications, the 5CEFA9F23C7N provides unmatched flexibility and efficiency. Elevate your projects to new heights with Intel's advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging solution for the FPGA.

No. of Logic Cells: 301000

Offers high logic density for complex logic design implementations.

Surface Mount: YES

Allows for easy integration onto circuit boards.

Maximum Supply Voltage: 1.13 V

Ensures stable operation within specified voltage limits.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

No. of Inputs: 230

Provides ample input ports for versatile connectivity options.

Package Shape: SQUARE

Facilitates efficient placement and routing on PCBs.

Form Of Terminal: BALL

Enables reliable connections with other components.

Nominal Supply Voltage (V): 1.1

Optimal voltage level for stable performance.

Power Supplies (V): 1.1,1.2/3.3,2.5

Supports multiple power supply options for flexible design configurations.

No. of Terminals: 484

Offers sufficient terminals for comprehensive interfacing requirements.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customizable logic implementation and design flexibility.

Package Style (Meter): GRID ARRAY

Provides a compact and organized layout for the package.

Minimum Supply Voltage: 1.07 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature environments.

Pitch Of Terminal: 1 mm

Allows for fine pitch connections to optimize PCB layout.

Minimum Operating Temperature: 0 °C

Capable of functioning at low temperatures for various applications.

Position Of Terminal: BOTTOM

Facilitates easy PCB mounting and soldering.

Maximum Seated Height: 2 mm

Ensures compatibility with standard board designs and enclosures.

Width: 23 mm

Compact width for efficient space utilization on the PCB.

No. of Outputs: 230

Offers an adequate number of output ports for diverse signal routing requirements.

Length: 23 mm

Optimal length for fitting into standard board designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CEFA9F23C7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

301000

No. of Inputs:

230

No. of Outputs:

230

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

5CEFA9F23C7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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